産業とアプリケーション
Export Spreadsheet
| 部品番号 | Web Description | ||||||||||||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 2200291025 | Micro-One Wire-to-Board Header, Vertical, 2.00mm Pitch, Single Row, Glow-Wire Capable, Through Hole, 2 Circuits, Tin-Bismuth Plating, Black, with Potting Capability | No | 2 | 2 | Black | 30 | No | 94V-0 | Yes | Yes | Brass | Tin-Bismuth | Tin-Bismuth | Liquid Crystal Polymer (LCP) | 689.200/mg | 1 | Vertical | Tray | 2.90mm | Yes | 2.00mm | 1.000µm | Yes | Shrouded | -40° to +105°C | Through Hole | |
| 2200291035 | Micro-One Wire-to-Board Header, Vertical, 2.00mm Pitch, Single Row, Glow-Wire Capable, Through Hole, 3 Circuits, Tin-Bismuth Plating, Black, with Potting Capability | No | 3 | 3 | Black | 30 | No | 94V-0 | Yes | Yes | Brass | Tin-Bismuth | Tin-Bismuth | Liquid Crystal Polymer (LCP) | 807.460/mg | 1 | Vertical | Tray | 2.90mm | Yes | 2.00mm | 1.000µm | Yes | Shrouded | -40° to +105°C | Through Hole | |
| 2200291045 | Micro-One Wire-to-Board Header, Vertical, 2.00mm Pitch, Single Row, Glow-Wire Capable, Through Hole, 4 Circuits, Tin-Bismuth Plating, Black, with Potting Capability | No | 4 | 4 | Black | 30 | No | 94V-0 | Yes | Yes | Brass | Tin-Bismuth | Tin-Bismuth | Liquid Crystal Polymer (LCP) | 921.910/mg | 1 | Vertical | Tray | 2.90mm | Yes | 2.00mm | 1.000µm | Yes | Shrouded | -40° to +105°C | Through Hole | |
| 2200291055 | Micro-One Wire-to-Board Header, Vertical, 2.00mm Pitch, Single Row, Glow-Wire Capable, Through Hole, 5 Circuits, Tin-Bismuth Plating, Black, with Potting Capability | No | No | 5 | 5 | Black | 30 | No | 94V-0 | Yes | Yes | Brass | Tin-Bismuth | Tin-Bismuth | Liquid Crystal Polymer (LCP) | 1035.370/mg | 1 | Vertical | Tray | 2.90mm | Yes | 2.00mm | 1.000µm | Yes | Shrouded | -40° to +105°C | Through Hole |
| 2200291065 | Micro-One Wire-to-Board Header, Vertical, 2.00mm Pitch, Single Row, Glow-Wire Capable, Through Hole, 6 Circuits, Tin-Bismuth Plating, Black, with Potting Capability | No | 6 | 6 | Black | 30 | No | 94V-0 | Yes | Yes | Brass | Tin-Bismuth | Tin-Bismuth | Liquid Crystal Polymer (LCP) | 1149.290/mg | 1 | Vertical | Tray | 2.90mm | Yes | 2.00mm | 1.000µm | Yes | Shrouded | -40° to +105°C | Through Hole | |
| 2200291075 | Micro-One Wire-to-Board Header, Vertical, 2.00mm Pitch, Single Row, Glow-Wire Capable, Through Hole, 7 Circuits, Tin-Bismuth Plating, Black, with Potting Capability | No | No | 7 | 7 | Black | 30 | No | 94V-0 | Yes | Yes | Brass | Tin-Bismuth | Tin-Bismuth | Liquid Crystal Polymer (LCP) | 1270.300/mg | 1 | Vertical | Tray | 2.90mm | Yes | 2.00mm | 1.000µm | Yes | Shrouded | -40° to +105°C | Through Hole |
| 2200291085 | Micro-One Wire-to-Board Header, Vertical, 2.00mm Pitch, Single Row, Glow-Wire Capable, Through Hole, 8 Circuits, Tin-Bismuth Plating, Black, with Potting Capability | No | 8 | 8 | Black | 30 | No | 94V-0 | Yes | Yes | Brass | Tin-Bismuth | Tin-Bismuth | Liquid Crystal Polymer (LCP) | 1384.220/mg | 1 | Vertical | Tray | 2.90mm | Yes | 2.00mm | 1.000µm | Yes | Shrouded | -40° to +105°C | Through Hole |