Board-to-Board Connectors

Fine-pitch battery connectors that provide up to 10.0A, a hybrid interface, wide alignment guides for easier mating and a robust metal armor cover that acts as housing protection for secure electrical and mechanical contact.

World’s smallest board-to-board connector ideally suited for space-constrained smartphones, smartwatches, wearables, AR/VR devices and more!

5G mmWave RF Flex-to-Board Connectors offer excellent signal integrity (SI) performance for high-speed, extreme RF applications, along with the robust mating features and PCB real-estate space savings needed in compact 5G mobile and other communication devices.

The C-Grid family of connectors offers benefits for a wide range of electronic products across industries. The latest version from Molex, C-Grid III, offers high mechanical stability in a compact 2.54mm pitch post and receptacle. Find the flexible C-Grid and C-Grid III components that fit your project.

KK connector systems are customizable for a variety of power and signal applications. Available in industry-standard 2.54, 3.96 and 5.08mm pitch sizes, this single-row, wire-to-board and board-to-board product family is cost effective and versatile.

Offers premium housing features to prevent mis-mating, reduce terminal backout, reduce operator fatigue during assembly and aid in blind-mating applications.

Micro-Fit+ Connectors are uniquely designed to meet the demands of power applications that require a compact, high-density solution without compromising performance or reliability. Learn more.

The Mini-Fit Connector family delivers an operating temperature up to +125° C, offers a double crimp tool and is available in Board-to-Board, Wire-to-Board and Wire-to-Wire configurations.

EXTreme Power products offer high-current interconnect solutions with best in class power densities. The extensive product offering ranges from EXTreme LPH 30.0A blades to EXTreme PowerMass 150.0A modules. Molex EXTreme Power products – made for your high-current applications.

Molex’s Sentrality Pin and Socket Interconnect System offers high-current board-to-board, busbar-to-board and busbar-to-busbar connectors and provides a +/- 1.00mm radial self-alignment to overcome tolerance stack-up issues.

Footprint-compatible hermaphroditic Mirror Mezz and Mirror Mezz Pro Mezzanine Connectors lower application costs eliminating the need for separate mating parts and offer maximum design flexibility by allowing the user to pair different connector height versions to achieve the desired stack height while supporting data speeds up to 112Gbps per differential pair for telecommunications, networking and other applications.

Low-profile SEARAY Mezzanine Connectors and Jumpers deliver a 12.5+Gbps data rate, small footprint and robust solder-charge termination while SEARAY Slim Connectors also improve airflow to address thermal management issues.

Delivering the connector with the fastest data rate in the market today at 56Gbps and the cleanest signal integrity, Molex’s modular NeoScale Mezzanine System features a high-speed triad wafer design for customized PCB routing in high-density system applications.

The SpeedMezz Connector family offers high-densities, low profiles, data rates up to 56Gbps per differential pair and easy upgrading with common receptacle footprints to deliver versatile solutions for high-speed mezzanine, rugged edge card and lower speed applications.

Designed for high-density, high-performance mezzanine applications, the HD Mezz Mezzanine Connector System simplifies PCB routing and maximizes card-slot space while delivering 12.5Gbps data rate.

Modular NeoPress High-Speed Mezzanine System enables design flexibility on space-constrained PCBs with tunable differential pairs, low stack heights and compliant-pin terminations while offering data rates up to 28Gbps.