| Attenuation | Frequency | Power (max.) | VSWR (max.) |
|---|---|---|---|
| 1 to 20 dB | DC to 18 GHz | 0.15 to 5W | 1.25:1 to 1.50:1 |
Features and Benefits
Designers are challenged with meeting size and weight targets for portable, aerial and space-borne systems. Thermal instability issues, including bulky heat sinks and hotspot-driven deration due to operating a high-power RF attenuator, must be addressed. Defense, aerospace and advanced medical platforms require components that can survive wide temperature swings and rigorous qualifications. Ultimately, these industries require compact and lightweight modules, thermal optimization and components that can withstand extreme environmental temperatures.
RF Chip Attenuators deliver plug-and-play, chip-scale attenuation that replaces bulky, discrete assemblies, freeing PCB space. Incorporating solder preparation and a hermetic seal for maximum conductive heat transfer, their layout guidelines include dense thermal-via arrays and a heavy-copper conductive plane to dissipate and remove RF heat. These attenuators are MIL-SPEC-tested, delivering the robustness required for demanding markets and ensuring stable, predictable performance in harsh or fluctuating thermal environments (-65 to +150°C). RF Chip Attenuators also meet tight size, weight and power requirements, making them ideal for aerospace, defense and space systems.
Applications by Industry
Proximity warning systems
Traffic collision-avoidance systems
E/W and T/R modules
Integrated microwave assemblies
Phased-array radars
MRI power electronics
FM and TV signal transmitters
High-power terminations for isolators and amplifiers
This is not a definitive list of applications for this product. It represents some of the more common uses.
Frequently Asked Questions
What are RF Chip Attenuators and what applications do they support?
RF Chip Attenuators are compact, chip-style components that precisely reduce RF signal levels while maintaining superior impedance matching. They support applications across Tx/Rx modules, amplifier chains, integrated microwave systems, switching networks and specialized markets including medical, aerospace and space systems.
How do Molex RF Chip Attenuators optimize link budget and improve dynamic range in high-performance RF systems?
These attenuators deliver precise, thermally stable attenuation, with impedance matching (≥20 dB return loss), minimizing insertion loss variability and signal distortion. Their outstanding thermal stability (±0.1 dB over -65 to +150°C) ensures consistent performance in extreme environments, preserving the signal-to-noise ratio and extending dynamic range—critical for phased-array radars, satellite links and advanced wireless applications.
What key electrical specifications make Molex RF Chip Attenuators stand out?
Molex attenuators offer selectable attenuation from 1 to 20 dB (up to 30 dB on request), operate from DC to 18 GHz and handle continuous power up to 5W in a compact alumina-ceramic package. Coupled with laser-trimmed accuracy and best-in-class thermal stability, these chip attenuators deliver reliable, precise attenuation for demanding RF front ends.
How do these attenuators simplify RF system design and manufacturing?
By replacing bulky discrete resistor networks with a single chip-scale component, these RF Chip Attenuators reduce BOM complexity and the PCB footprint. This integration accelerates assembly, lowers inventory overhead and improves first-pass yield—helping engineers expedite time to market while cutting system costs.
Why is thermal stability critical for RF Chip Attenuators in harsh environments?
Thermal stability ensures attenuators' performance remains consistent despite wide temperature swings from –65 to +150°C, which are common in defense, aerospace and medical applications. Stable attenuation reduces calibration drift, minimizes field failures, lowers maintenance costs and supports long-term system reliability in extreme environments.