| Frequency | Power (max.) | Impedance | VSWR (max.) |
|---|---|---|---|
| DC to 12.4 GHz | 10W (<4 GHz) | 50 or 100 ± 2 Ohms | 1.25:1 |
Features and Benefits
Designers looking to optimize RF termination capabilities face a variety of challenges. Signal ripples and resonances caused by parasitic inductance and capacitance can cause impedance mismatches that degrade VSWR and increase insertion loss. High-power systems require robust heat dissipation capability to prevent failures. Testing and qualification of components can slow development processes and increase costs.
Smaller, higher-density chip terminations with advanced thermal management properties help eliminate bulky heat sinks, enabling higher component density and reduced weight. High-precision components deliver ripple-free performance that avoids reflections and signal distortions, enhancing power efficiency while minimizing failure rates and maintenance costs. Robust construction and prequalified solutions help shorten time to market by ensuring optimal system uptimes and minimizing testing and certification time.
Surface-Mount Chip Terminations from Molex enable efficient heat management without the need for heavy, bulky cooling hardware. These terminations employ low-parasitic end-wrap packaging, precision surface-mount technology (SMT) attachment and optimized metallization to maintain VSWR ≤1.25:1 across the full DC to 12.4 GHz range; minimize inductance and capacitance; suppress ripples; and mitigate resonant effects in the signal path. Prequalified to MIL-PRF and AEC-Q200 standards, these terminations ensure vibration- and shock-resistant performance while helping manufacturers avoid extra qualification processes.
Applications by Industry
Proximity warning systems
Spacecraft and satellite systems
Traffic collision avoidance systems
Electronic warfare and transmit/receive modules
Integrated microwave assemblies
Phased-array radars
Magnetic resonance imaging power electronics
5G and distributed antenna system repeaters/transmitters
FM and TV signal transmitters
High-power terminations for isolators and amplifiers
In-building wireless infrastructures
This is not a definitive list of applications for this product. It represents some of the more common uses.
Frequently Asked Questions
What are Surface-Mount Chip Terminations?
Directly mounted to the PCB, Surface-Mount Chip Terminations are components that terminate RF circuits and dissipate thermal RF energy in a compact form factor that minimizes space usage on the PCB.
Why choose Molex for Surface-Mount Chip Terminations?
Molex offers RF Surface-Mount Chip Terminations prequalified to rigorous military and aerospace standards, featuring advanced beryllium oxide substrates for superior thermal dissipation. Molex products deliver precise 50-Ohm impedance matching; low VSWR up to 12.4 GHz; and rugged, vibration-resistant construction.
How do RF Surface-Mount Chip Terminations manage thermal dissipation without bulky heat sinks?
Molex RF Surface-Mount Chip Terminations use a high-thermal-conductivity beryllium oxide substrate that efficiently channels heat directly into the PCB using or through thermal vias and copper planes. This eliminates the need for external heat sinks, enabling smaller, lighter modules while maintaining safe continuous power dissipation up to 10W.
What frequency range and power levels are supported by these terminations?
Molex RF Surface-Mount Chip Terminations operate from DC up to 12.4 GHz, making them suitable for modern wireless and defense systems, including 5G and satellite communications. They can handle continuous power dissipation up to 10W, with a tight ±2% resistance tolerance and typical VSWR of ≤1.25:1, ensuring minimal signal reflection and stable system performance.
Are these chip terminations suitable for harsh environments and military applications?
Yes, Molex Surface-Mount Chip Terminations are prequalified to MIL-PRF-55342, MIL-PRF-55182 and MIL-DTL-8833 standards, ensuring they meet stringent reliability requirements for temperature extremes (–55 to +125°C), vibration, shock and mechanical stress.