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224 Gbps-PAM4 High-Speed Data Center Technology

We stand on the edge of a precipice representing the greatest technological shift since the emergence of the smartphone. The societal value and influence of generative artificial intelligence (AI) cannot be overstated, with the potential to reinvent industries from automotive to quantum computing and genomics. Yet turning the ideas of today’s technology leaders and emerging entrepreneurs into reality requires the data center of the future. Learn how Molex’s industry-leading comprehensive portfolio of 224 Gbps-PAM4 products and custom architecture designs are enabling a new type of data center built to meet the increasing demands of AI, machine learning (ML), 1.6T networking and other high-speed applications. Our team of experienced design engineers is ready to collaborate with you. Unlock the potential of 224G by connecting directly with the engineering team pioneering this innovative technology.

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Overview

Generative AI requires a paradigm shift in the approach to data. Although the theme of “need more, faster” remains consistent, the supporting infrastructure of hyperscale data centers now face the limitations of physics. The exponential increase in ML and AI applications is driving a market growth trajectory that is expected to meet or exceed $2 trillion USD by 2030. Such astronomical expansion is only sustained by building next generation data centers on 224 Gbps-PAM4 architecture. 

Molex’s comprehensive portfolio of 224G products has been brought to market through interdisciplinary engineering and close collaboration with our customers. This co-development has united disciplines from connectivity and data to components and signal integrity to make 224G both possible and practical. Learn more about our 224 Gbps-PAM4 solutions and how Molex is uniquely positioned to help companies build to application demand at the earliest stages of architecture design. 

224G Product Portfolio Within Example Architecture 

224 Product

    

Building the Next-Generation Data Center

The potential of AI cannot be fully realized with today’s data center architecture. Synergistic solutions purpose-engineered for high-speed data center applications provide a path to revolutionizing data center design. Learn more about key design considerations and valuable connectivity solutions for the next evolution of data center architecture built for 224G.

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224g

Featured Products

Why Copper Interconnects are Still Important in the Age of 224G

To achieve groundbreaking 224Gbps speeds, high-speed copper interconnects play a critical role ensuring reliability, cost-efficiency, and scalability in the most demanding applications. Learn more in our webinar.

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Mirror Mezz Enhanced 224G Board-to-Board Connector

This expansion to our current family of proven, genderless high-speed mezzanine board-to-board connectors offers the performance necessary for 224G while minimizing the space taken on the PCB. The genderless mating interface and mated height options can help expedite new connector module availability, increasing efficiency while often simplifying the bill of materials (BOM). The use of electrically tuned contacts and an industry standard ball grid array (BGA) PCB attach improves signal integrity, eases connector assembly and provides significant protection from damage.

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Mirror Mezz

Inception 224G Genderless Backplane and Cable

The Inception family of genderless backplanes and cables enable superior application flexibility with variable pitch densities, optimal signal integrity and simplified integration. The simplified SMT launch reduces the need for complicated board drill and via processing at the PCB interface. The multiple wire gauge options can be partnered with custom lengths internal and external to the application for optimized channel performance.   

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Liz Hardin
"Simply put, 224 Gbps-PAM4 products are not optional. We’re just scratching the surface of generative AI applications, and for its potential to be fully realized, we’ll need to work together to evolve into the next generation of data centers."
Liz Hardin
Director of Marketing, Enterprise Solutions
Molex

CX2 Dual-Speed 224G Near-ASIC Cabled Connector System

As data rates increase to 224G, maintaining signal integrity (SI) becomes increasingly crucial. Cabled solutions for the chip-to-chip channel can help meet this challenge by delivering better SI performance when compared with traditional PCB traces. The CX2 Dual-Speed 224G interconnect system uses low-loss twinax cable and an innovative shielding structure, together with a high-density interface that maximizes real estate on the board, to ensure optimal performance for near-ASIC connectivity.

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Cable Assembly

OSFP 1600 Solutions

This next-generation upgrade to our current OSFP product family includes SMT, BiPass and external cable solutions. Built for 224 Gbps-PAM4, these robust cables offer superior mechanical durability and excellent shielding to minimize crosstalk and deliver better signal integrity (SI) performance at a higher Nyquist frequency.

  • SMT Connector and Cage: Superior shielding from the mating interface to the SME tails and board ensures 224 Gbps channel operation and lower Bit Error Rate (BER).

  • BiPass: Standardized twinax that combines I/O with near-ASIC and Backplane solutions provide greater design flexibility. 

  • Direct Attach (DAC) and Active Electrical Cables (AEC): Multiple cable configurations, optimized wire termination and CMIS support for system troubleshooting tailor solutions to application requirement.

QSFP

QSFP 800 & QSFP-DD 1600 Solutions

Like our OSFP product family, our upgraded QSFP and QSFP-DD products are designed for 224 Gbps-PAM4 and offer excellent shielding to minimize crosstalk and improve performance at a higher Nyquist frequency. The family has been re-engineered to improve mechanical robustness including contact normal force, and encompasses SMT, BiPass and external cable solutions.

  • SMT Connector and Cage: Ensure 224 Gbps channel operation and lower Bit Error Rates (BER) with these durable solutions offering superior shielding. 

  • BiPass: Reduce thermal load, lower rack costs and increase design flexibility with our BiPass solutions that utilize standardized twinax combining I/O with near-ASIC and Backplane solutions. 

  • Direct Attach (DAC) and Active Electrical Cables (AEC): Build to your specific requirements with our passive, DAC solutions that are ideal for low cost, low latency applications and our retimed, AEC cables that offer superior serviceability at a lower cost compared to optics.  

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Featured Resources

Report

Thermal Management for Next-Generation Data Centers

With demands for computing power at an all-time high, thermal demands have never been greater. This report explores the limitations of current thermal management strategies for I/O modules and delves into new innovations to help address the demand of systems requiring 112G and 224G PAM-4 links.

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WEBINAR

Designing 224 Gbps-PAM4 Systems for Generative AI Architectures

Revolutionary 224G technology is poised to enable the transformative power of generative AI. But first, 224G-capable systems are needed. In a recent panel discussion, experts from Molex, NVIDIA and Marvell explored the challenges and opportunities of designing groundbreaking 224G systems.  

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Scale Up

The Continuing Evolution of PCIe

Emerging high-performance applications from AI to AR are placing unprecedented demands on data center technologies. To keep up, system architects need high-speed, low-latency and highly scalable solutions. Explore how PCIe has evolved over the generations and how Molex has been at the forefront of PCIe Gen 5, 6 and even 7. 

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Server Compute PCIe

SCALE UP

Data Center Architecture Designed for Flexibility and Scalability in 224 Gbps PAM-4 Systems

To keep pace with advances in generative AI and machine learning, data centers are now compelled to scale up system fabrics to support data transmission rates of 224 Gbps using the PAM-4 modulation scheme on every differential pair. Read how Molex is enabling this scale-up approach with Inception, CX2-DS and Mirror Mezz Enhanced.

Next-Gen Solutions

Capabilities

Building Blocks of High-Performance Computing

Before data centers can upgrade to next-generation data transfer rates, they must first address the complex design issues of thermal management, scalability and connectivity throughout their infrastructure. See how Molex innovations support the implementation of advanced modular architectures to help address these complex challenges.

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Scale Up

Explore the Next Generation of Hyperscale

The next generation of hyperscale data centers goes beyond just 224 Gbps-PAM4 solutions. Learn how Molex is empowering system architects with engineering expertise and innovative interconnect solutions, such as our NearStack PCIe Connector System, to scale up and scale out these expansive facilities.

Discover Hyperscale Solutions

Featured Videos

Solutions for Next-Generation Data Centers

Generative AI offers the potential to reinvent virtually every industry. But next-generation 224G speeds are required to meet the demands of AI and other advanced applications. Learn about this technological shift for data centers of the future, as well as the challenges and opportunities that come with these higher speeds.

Efficiently Cool Next-Gen Pluggable IO with Drop Down Heatsinks

Costly liquid cooled solutions aren’t the only option for next-gen pluggable IO at 224G. Molex’s Drop Down Heatsink (DDHS) provides best-in-class thermal improvement of +5°C over traditional heatsinks and 30W+ air cooled solutions without increasing fan power and speed. This innovative design enables thermal interface material (TIM) to be applied without risking durability and performance.  

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