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Cardinal Multi-Port High-Frequency Coaxial Assemblies.

Cardinal Multi-Port High-Frequency RF Test Cables

Providing versatile and scalable test solutions for high-speed datacom, 5G/6G, mmWave radar and other advanced applications, Cardinal Multi-Port High-Frequency Coaxial Assemblies deliver phase-matched, high-precision connections up to 145 GHz. Solderless compression attachment and high-density PCB connection improve versatility, minimize downtime and accelerate testing operations while maintaining consistent performance over 500+ mating cycles.

Frequencies Data Characterization Rate Port Configuration Cable Connectors
DC to 145 GHz Up to 448Gbps Single-row 1x4 or 1x8; dual-row 2x8 1.85, 1.0, 0.8mm coaxial

Features and Benefits


The development of higher-frequency mmWave systems such as 5G/6G, quantum computing and high-speed datacom networks has led to a need for high-precision testing at elevated frequency ranges. Manufacturers require advanced testing connections that support repeated mating/un-mating cycles, optimize evaluation board space and maintain consistent signal integrity at high frequencies.

Precision multi-port coaxial cable assemblies can accelerate testing operations by consolidating several lines into a single, compact connector. Using high-performance RF connectors and compression-mounted PCB attachment enables repeatable and scalable test solutions. This reduces the total cost of ownership by minimizing installation and rework time, enabling use across multiple systems and devices, and simplifying upgrades.

Cardinal Multi-Port High-Frequency Coaxial Assemblies deliver high precision and minimal signal loss at mmWave frequencies up to 145 GHz. These assemblies offer data characterization rates up to 448Gbps, supporting precision testing of complex next-generation devices and systems. Compression PCB mounting, high-density connections and durable construction rated at 500+ mating cycles help economize PCB space, accelerate testing work, minimize downtime and improve adaptability.

Exceptional Precision at High Frequencies

Cardinal multi-port assemblies maintain ±1ps phase matching and minimal signal loss for mmWave frequencies up to 145 GHz, supporting data characterization rates up to 448Gbps and enabling use with next-generation, high-performance devices and systems.

Cardinal Multi-Port High-Frequency Coaxial Assembly showing the 1x4 PCB connector.

Dense PCB Interface for Complex Board Layouts

Consolidating multiple lines into a single PCB connector reduces installation time and simplifies testing processes. The high-density PCB interface minimizes board real estate compared to discrete RF connectors, permits placement adjacent to the serializer/deserializer and offers various exit options for improved design flexibility.

Edge-mount PCB termination for a 1x8 Cardinal multi-port connector.

Versatile and Reworkable Compression Interface

Use of a solderless, compression-mount PCB connector that supports 500+ mating cycles reduces installation and changeover work in lab environments, accelerating demanding testing workflows.

Cardinal multi-port 1x8 solutions showing a cable assembly and connector with edge-mount and vertical PCB terminations.

Enables future growth in high-performance device testing
Supporting mmWave frequencies up to 145 GHz and data characterization rates up to 448Gbps, these assemblies enable future-proofing of test and measurement capabilities.

Delivers high-precision connectivity
Phase matching to ±1ps provides signal synchronization for optimal performance and data transfer, minimizing latency and enhancing signal integrity.

Ensures long-term durability
A rating of 500+ mating cycles enables use with demanding test workflows and reduces the total cost of ownership.

Minimizes the PCB footprint
The high-density PCB connector reduces the space required for board connections, shortening trace lengths and enabling smaller evaluation boards.

Accelerates testing operations
Consolidating multiple connections into a single PCB connector reduces installation time and downtime while avoiding inconsistent signal integrity between individual RF connectors.

Improves board design flexibility
Solder-free compression termination to the PCB with vertical, right-angle and edge-mount options reduces installation complexity, simplifies reconfigurations and minimizes rework.

Datasheets and Guides


Applications by Industry


High-frequency communications
Satellite communications

Radar system validation equipment

High-frequency communications
Satellite communications

Imaging
Patient Monitors

High-frequency cabling
Hyperscale computing architectures
Quantum computing architectures

5G and 6G networks
Servers
Switches

This is not a definitive list of applications for this product. It represents some of the more common uses.

Frequently Asked Questions


What are Cardinal Multi-Port High-Frequency Coaxial Assemblies?

Cardinal Multi-Port High-Frequency Coaxial Assemblies are solderless, modular cable solutions that support frequencies up to 145 GHz with superior signal integrity for precise, high-density testing applications.

How do Cardinal Multi-Port High-Frequency Coaxial Assemblies create value for manufacturers?

Offering high-precision performance up to 145 GHz supports next-generation applications, enabling upgrades. Consolidating multiple RF connectors into a single housing decreases the time needed for mating/unmating, reducing testing time and labor costs. The high-density PCB interface minimizes board real estate, allowing smaller evaluation boards and reducing costs. Compression mounting to the board makes installation and changeovers easier and faster, minimizing downtime and rework while improving test program versatility and scalability.

What cable lengths are available with Cardinal multi-port assemblies?

Cardinal multi-port assemblies are available standard with 6, 12, 24 or 36″ (152, 305, 610 or 914mm) coaxial cables. Other cable lengths are also available as custom solutions.

How do solderless assemblies benefit my test setup compared to traditional soldered connections?

Solderless assemblies reduce setup time, allow for easy reconfiguration, eliminate rework during adjustments and maintain consistent performance, making them ideal for dynamic testing environments.