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Board-to-Board Connectors

Mirror Mezz Connectors

The Mirror Mezz family of stackable, hermaphroditic mezzanine connectors delivers superior signal integrity (SI) performance and data speeds up to 224Gbps to address ever-increasing data transmission requirements for telecommunications, networking and other high-density applications, including Open Compute Project (OCP)-compliant systems. Mirror Mezz, Mirror Mezz Pro and Mirror Mezz Enhanced Connectors share a common footprint and hermaphroditic construction, helping improve design flexibility, streamline assembly and simplify procurement.

Data Rate Pitch Stack Height Pin Count
up to 224Gbps 4.00 by 1.50mm differential pair pitch 5.00, 8.00 and 11.00mm Up to 270 differential pairs

112G Mirror Mezz Connectors

112G Mirror Mezz Pro Connectors

224G Mirror Mezz Enhanced Connectors

Mirror Mezz Connector Family


As data-rich applications drive demand for faster speeds and improved signal integrity (SI), system designers need to upgrade and scale capabilities in a cost-effective manner. This means maximizing PCB real estate, controlling sourcing and assembly costs, and ensuring sufficient performance and durability to meet end-user requirements.

Hermaphroditic mezzanine connectors offer an innovative solution to board-to-board connectivity. The design reduces procurement, inventory and tooling costs while simplifying assembly operations and improving overall productivity. The Open Compute Project (OCP) supports a standardized 15x11 mezzanine connector footprint for enhanced interoperability and design flexibility.

Mirror Mezz Connectors deliver next-generation capabilities for high-performance computing needs. The first board-to-board solutions of their type with data speeds up to 224Gbps, Mirror Mezz Connectors feature up to 270 differential pairs (DPs) in a high-density design that optimizes space with 107 to 115 DPs per square inch. Ball grid array (BGA) termination simplifies engineering and assembly work while the hermaphroditic design reduces tooling, inventory and operational costs. The standardized 15x11 OCP-compliant footprint supports scalability and helps streamline upgrades.

Mirror Mezz Connectors

Recommended by OCP for board-to-board mezzanine interconnect applications, Mirror Mezz Connectors deliver superior signal integrity and up to 112Gbps performance in a robust, hermaphroditic form factor and a variety of circuit sizes.

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Mirror Mezz Pro Connectors

Mirror Mezz Pro Connectors provide 112Gbps performance in an OCP-recommended form factor, enabling three stack height options with up to 270 differential pairs in a high-density layout with a robust “stubless” contact interface and blind-mating capability for easy assembly.

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Mirror Mezz Enhanced Connectors

As increased use of AI drives demands faster speeds, Mirror Mezz Enhanced Connectors answer the challenge with data rates up to 224Gbps PAM-4 for next-generation applications. Mirror Mezz Enhanced Connectors feature the high SI, robust construction and hermaphroditic design of other Mirror Mezz Connectors, supporting design flexibility and system reliability.

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Features and Benefits


Hermaphroditic mating interface simplifies procurement

The innovative hermaphroditic design streamlines design and assembly by requiring only one component for both halves of a mated set. This simplifies the bill of materials (BOM) and inventory management while minimizing tooling requirements, leading to improved manufacturing efficiency.

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Height options make stack height customization easy

Mirror Mezz Connectors are available in 2.50 and 5.50mm heights, permitting customization of stack heights with minimal tooling. Cross-mating or self-mating of connectors permits ultra-low and medium stack heights of 5.00, 8.00 or 11.00mm, enhancing design flexibility and ease of integration.

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Stubless contact interface improves signal integrity

Designed for exceptional signal integrity, the “stubless” contact interface features two points of contact on each beam for greater reliability and a low-profile minimum stack height of 5.00mm. The opposing beam support structure helps ensure consistent and reliable electrical contact by preventing terminal lift, offers reliable normal force for harsh environments and ensures sufficient engagement with 1.50mm of nominal contact wipe.

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BGA design enhances flexibility and streamlines integration

The low-profile stitched BGA surface mount technology (SMT) termination design enhances flexibility and offers greater cost savings when compared with insert-molded BGA attachments. By easing integration, the design helps reduce lead times and simplify the overall product matrix for more efficient and cost-effective manufacturing.

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Mirror Mezz Connector Family 

Reduces mis-mating and assembly errors through a robust shrouded housing design
Shrouding encapsulates the pin field, helping protect pins and offering blind-mate guidance to help eliminate mis-mating.

Eases design challenges by maximizing PCB real estate
The high-density connector pin field includes up to 270 differential pairs. 

Offers increased reliability and minimizes crosstalk between rows
Opposing beam support helps ensure improved performance through a 1.50mm row pitch.

Simplifies assembly operations
The contact tip design offers fine alignment of 0.70mm in blind-mating scenarios, making mating operations easier and more reliable. The contact tip design offers fine alignment of 0.70mm in blind-mating scenarios, making mating operations easier and more reliable.

Mirror Mezz and Mirror Mezz Pro Connectors 

Delivers reliable high-speed data transmission rates 
Mirror Mezz and Mirror Mezz Pro Connectors support data rates up to 112Gbps NRZ. 

Improves design flexibility with 15x11 OCP-compliant design 
The connector is recommended by OCP for 15x11 mezzanine board-to-board interconnect applications, ensuring interoperability for OCP-standard systems. 

Offers relaxed tolerances and greater architectural flexibility with flex cable links 
The design accommodates offsets between boards while flexible system components with flex cable links offer controlled channels and pinned grounds. 

Mirror Mezz Enhanced Connectors 

Delivers high-speed data transmission rates for next-generation applications 
Mirror Mezz Enhanced Connectors offer 224Gbps NRZ data speeds, supporting high-performance applications such as AI and machine learning. 

Maximizes high-speed performance and clean routing out of the connector footprint 
The precise arrangement of wide ground pins and electrically tuned signal contacts improves SI and helps balance the electrical field. 

Permits seamless upgrades to 224Gbps speeds 
Having the same footprint dimensions as Mirror Mezz and Mirror Mezz Pro Connectors helps reduce PCB redesign requirements. 

Optimizes PCB real estate with higher differential pair (DP) density 
Mirror Mezz Enhanced Connectors feature up to 270 full DPs and 24 single-ended pins, resulting in more DPs per square inch and enhancing the design’s versatility. 

Datasheets and Guides


Mirror Mezz Connector Videos


High-Speed Board-to-Board 

Learn more about Mirror Mezz design features generating space and cost savings, offering much higher density than the industry average.

Applications by Industry


Infrastructure
Networking

This is not a definitive list of applications for this product. It represents some of the more common uses.

Frequently Asked Questions


What are the differences between Mirror Mezz Enhanced and other Mirror Mezz solutions?
Mirror Mezz Enhanced supports faster signal speeds of up to 224Gbps and has improved signal integrity performance when compared with Mirror Mezz and Mirror Mezz Pro.

Which Mirror Mezz solution is right for my application?
Mirror Mezz, Mirror Mezz Pro and Mirror Mezz Enhanced mezzanine connectors offer excellent data speeds and signal integrity to meet next-generation data center requirements. Molex offers a wide variety of circuit counts for different applications. Please contact us for details.

How many stack height options does Mirror Mezz Enhanced offer?
Similar to Mirror Mezz and Mirror Mezz Pro, Mirror Mezz Enhanced comes with three different stack heights of 5.00mm, 8.00mm and 11.00mm through the combination of 2.50mm and 5.50mm high connectors.

ON-DEMAND WEBINAR

The Enduring Edge of Copper: Copper Interconnects in the Age of 224G

Discover the latest innovations in high-speed board-to-board connectivity, exploring the evolution of the Mirror Mezz product family and its ability to support data speeds up to 224Gbps. Learn why copper interconnects remain essential in today's tech landscape, offering unmatched speed, efficiency, and compliance for high-bandwidth applications.

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