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Molex NeoScale Connectors

NeoScale Connectors

High-speed, high-density board-to-board signal routing requires connectors optimized for superior signal integrity and reliability in a small footprint. NeoScale Connectors deliver data rates up to 56Gbps in a compact, scalable and modular design that incorporates differential-pair, single-ended and power contacts. These mezzanine connectors ensure reliability, improve design flexibility and minimize crosstalk in dense, high-performance applications.

Minimum Configuration Maximum Configuration Current
2 by 4 8 by 30 8.0A per triad

Mezzanine Plugs

Molex NeoScale mezzanine plug with 68 triads.

Mezzanine Receptacles

Molex NeoScale mezzanine receptacle with 68 triads.

Features and Benefits


The increasing need for high-speed data transfer in a wide variety of devices and applications means design engineers must fit more interconnect capability into less space. Real estate on PCBs must be optimized for high-density connections without sacrificing signal integrity, data transmission reliability or equipment performance.

By using modular, high-density mezzanine connectors, designers can deliver high-density signal and power routing in space-constrained architectures. Shielded differential-pair interconnects enable clean and reliable signal transmission at high data rates, while connectors designed with multiple configuration options help designers optimize board spacing and routing to meet specific design requirements.

NeoScale Connectors provide high-density board-to-board connections that conserve PCB space while supporting high-speed system requirements. The shielded triad wafer design supports reliable signal integrity at data rates up to 56Gbps, while the two-piece mezzanine design uses patented solder-charge technology to ensure robust, durable solder joints and error-resistant mating. Modular construction and a choice of stack-height options enable designers to optimize board space and PCB routing in compact architectures, streamlining design work and enabling use with a variety of telecommunications and networking applications.

Conserve PCB Space While Scaling Data Performance

High-density NeoScale mezzanine connectors help engineers fit more high-speed data connectivity into smaller spaces on the PCB by providing 82 differential pairs per square inch, enabling upgrades without the need for expanded system footprints.

Molex NeoScale high-density mezzanine connector.

Maintain Signal Integrity at High Speeds

Reliable data transmission at high speeds requires exceptional signal integrity. NeoScale Connectors use a triad wafer design that isolates each differential pair with dedicated grounds, enabling consistent performance up to 56Gbps for high-density telecommunications and networking applications.

Molex NeoScale Connector featuring a triad wafer design.

Improve Routing Flexibility and Reliability

Supporting versatile and scalable designs, NeoScale Connectors use modular triad wafer configurations with a mirror-image layout, offer multiple stack heights and provide 85- and 100-Ohm impedance options to optimize board spacing and reduce routing complexity. Patented solder-charge technology ensures robust surface-mount (SMT) solder joints.

Molex NeoScale Connectors with modular triad wafer design.

Simplifies design work and enhances adaptability
Modular triad wafer configurations support high-speed differential pairs, single-ended lines and power contacts, enabling customizable signal routing that meets specific application needs and supports scalable, versatile architectures.

Minimizes space requirements in compact architectures
Available stack heights from 12.00 to 40.00mm help optimize board real estate and board-to-board spacing.

Reduces crosstalk and signal loss
A mating interface with 2.00mm contact wipe and honeycomb housing construction that isolates each differential pair helps maintain clean, stable signal transmission in dense architectures.

Helps prevent terminal damage during mating
Tombstone structures in the receptacle housing protect the mating contact interface, reducing the change of damage and enhancing reliability.

Improves assembly reliability
Patented solder-charge technology provides robust SMT attachment, strengthening solder joints and ensuring long-term durability.

Supports high-speed design requirements
Enabling data rates up to 56Gbps and offering 85- or 100-Ohm impedance options, these connectors meet stringent requirements for high-performance systems.

Videos


NeoScale Mezzanine Connectivity

Meeting the need for high-density, high-speed connections that support superior signal integrity in confined footprints, NeoScale Connectors enable modular and customizable mezzanine connectivity. Learn how the triad wafer design, durable solder-joint attachment, and multiple contact and stack-height options deliver versatile, scalable and high-performance solutions for board-to-board connectivity.

Applications by Industry


Personality Cards

High data-rate scanning

NAS towers
Rack-mount servers
Servers
Switches

This is not a definitive list of applications for this product. It represents some of the more common uses.

Frequently Asked Questions


What are NeoScale Connectors?

NeoScale Connectors are high-speed board-to-board mezzanine connectors designed to route signals and power between stacked PCBs in compact systems. These connectors use a modular triad wafer design to support high-density layouts, clean signal integrity and customizable PCB routing.

What data rates do NeoScale Connectors support?

NeoScale Connectors support high-speed data transmission up to 56Gbps, helping design engineers address fast data-rate requirements in telecommunications, networking, servers and other high-performance applications.

How do NeoScale Connectors help save PCB space?

NeoScale Connectors provide an ultra-high-density signal solution with 82 differential pairs per square inch, enabling engineers to fit more high-speed connectivity into limited PCB real estate while supporting compact board-to-board designs.

How do NeoScale Connectors support signal integrity?

NeoScale Connectors use high-speed triad wafers with two signal pins and one shielded ground pin per differential pair. This design isolates each differential pair to help reduce crosstalk and support clean, reliable signal transmission.

What design options are available for NeoScale Connectors?

NeoScale Connectors offer modular triad wafer configurations, 85- and 100-Ohm impedance options, multiple stack heights and support for differential signals, single-ended signals and power contacts, giving engineers flexibility to tailor the connector to system requirements.