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NeoScale Connectors

Delivering the connector with the fastest data rate in the market today at 56Gbps and the cleanest signal integrity, Molex’s modular NeoScale Mezzanine System features a high-speed triad wafer design with Solder Charge Technology for customized PCB routing in high-density system applications.

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Minimum Configuration Maximum Configuration Current
2 by 4 8 by 30 8.0A per triad

Features and Benefits

Telecommunications and networking companies are facing space constraints on their PCBs as they try to keep up with high-speed data demands. NeoScale High-Speed Mezzanine System fills the void in the connector industry for a flexible mezzanine solution that supports the full range of high-speed signal design needs.

High-density connectors often have issues with signal integrity (SI), compromising the reliability and performance of equipment. NeoScale High-Speed Mezzanine System offers a triad wafer design that isolates each differential pair for optimal SI performance.

Telecommunications customers may have had trouble finding a connector that achieves data rates up to 56 Gbps. NeoScale High-Speed Mezzanine System has been test to achieve up to 56 Gbps, which is twice as fast as originally promoted when it was launched in 2012.

Modular triad wafer design with 4 triad configurations and high-speed differential pairs (in both 85 and 100 Ohm impedance), high-speed single-ended traces, low-speed single-ended lines and power contacts
Provides a customized system for design flexibility.

High-speed triad wafers comprise 3 pins per differential pair (2 signal pins and 1 shielded ground pin)
Provide stand-alone 56Gbps fully shielded differential pairs with dedicated grounds.

Mirror-image triad layout enables the PCB routing in 1 or 2 layers for 4- and 6-row housings respectively
Provides ease in PCB routing and lowers overall system costs by decreasing the number of PCB layers required for signal routing.

Available in 12.00 to 40.00mm stack heights, circuit sizes of 24 to 120 triad wafers in 4 and 6 rows and 85 or 100 Ohm impedance
Provides design flexibility.

Innovative PCB connection using patented Solder Charge Technology
Proven surface mount technology (SMT) attachment method for highly reliable and robust solder joints.

Housing design based on honeycomb construction
Isolates each differential pair for optimal performance and customization.

Connectors have a density of 82 differential pairs per square inch
Offers ultra-high-density signal solution with optimal signal integrity performance.

Tombstone structures incorporated within the receptacle housing
Prevents terminal damage by protecting the mating contact interface.

Reliable mating interface with 2.00mm wipe
Gives sufficient conductive wipe for clean signal transmission and enhanced performance.

Durable housing material
Delivers a robust system with mechanical stability.

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Applications by Industry

Personality Cards

High data-rate scanning

NAS towers
Rack-mount servers
Servers
Switches

This is not a definitive list of applications for this product. It represents some of the more common uses.