AirBorn Rugged Flexible Circuit Assemblies deliver advanced interconnect solutions for mission-critical applications across aerospace, defense, robotics and medical devices. Engineered for both static and dynamic flexing, these assemblies enable compact, lightweight designs while maintaining reliable electrical performance under vibration, repeated movement and extreme environmental conditions. Multiple configurations including single- and double-sided, multilayer, rigid-flex, sculptured flex and HDEC flex formats allow engineers to implement complex interconnects without compromising durability or signal integrity.
Material selection and specialized finishes ensure consistent operation in harsh conditions. AirBorn flexible circuit assemblies utilize polyimide, copper alloys and advanced coatings to resist high temperatures, chemical exposure and mechanical stress. Unique technologies such as HDEC enhance routing density and long-term reliability. Custom solutions supporting up to 15 layers meet the most demanding interconnect challenges while minimizing size, weight and complexity.
Each assembly benefits from full-lifecycle support, including initial design consultation, prototyping, assembly, automated inspection, testing and supply chain management. This integrated approach accelerates time to market and reduces development risk, enabling reliable deployment in the harshest operational environments.
