As AI and hyperscale networks push toward 800Gbps and 1.6Tbps, traditional board-routed copper can no longer maintain the required signal integrity or power efficiency. While moving interconnects closer to the ASIC is necessary, permanent attachment methods introduce risk, making rework difficult and increasing the potential for damaging high-value substrates. Many engineering teams are left navigating between copper approaches that are reaching their limits and optical architectures that are not yet practical for broad deployment.
Shortening the electrical path is now a requirement for sustaining performance at higher data rates. The shift must also preserve serviceability by using attachment methods that allow maintenance and upgrades without compromising the substrate or ASIC package. This pragmatic approach balances performance gains with operational realities, creating a bridge that extends copper while aligning with future near-ASIC and optical architectures.
Molex addresses these challenges with a full-channel co-packaged copper (CPC) solution that includes on-substrate routing with validated 224Gbps-PAM-4 performance and a clear roadmap to 448G. This architecture reduces channel loss while easing PCB design constraints. By utilizing the Impress CPC compression-attached design, which does not require surface mount technology (SMT) nor drilling, the system protects the substrate and supports rework by maintaining a clear service boundary away from the ASIC package. Based upon proven on-substrate platforms, this approach provides a scalable path toward External Laser Small Form Factor Pluggable (ELSFP) and co-packaged optics while delivering the reliability and practicality expected from copper.
