Rectangular Connectors

Available in wire-to-wire and wire-to-board designs, Pin and Socket Connectors feature dual-locking lances and a multipoint contact layout, ensuring secure engagement and helping prevent poor contact wipe in applications with current requirements up to 17.0A. These connectors, available in 0.062" and 0.093" versions, offer broad flexibility for long-life designs with tough nylon housings and robust terminals.

Compact, high-reliability Micro-Lock Plus Connectors are wire-to-board and wire-to-wire solutions designed for applications requiring secure connections and excellent performance in high-vibration environments. Flexible configurations and rugged mechanical features ensure reliable performance and strong vibration resistance, making these connectors ideal for high-current, high-temperature and space-constrained applications.

Supporting data rates up to 224Gbps, Mirror Mezz and Mirror Mezz Pro Connectors are high-speed, board-to-board interconnect solutions designed for optimal SI and space-savings in advanced electronic systems. Hermaphroditic design reduces procurement, inventory and tooling costs while maximizing PCB real estate. These connectors are optimized for data-rich applications in high-performance computing environments.

Leveraging patented Solder Charge technology, these connectors provide exceptional reliability and reduce applied costs compared to ball grid array (BGA) connectors. SEARAY and SEARAY Slim Connectors are high-density, high-speed board-to-board interconnect solutions that provide superior electrical performance and reliable connectivity in compact designs. They support data rates up to 12.5Gbps for high-density signal transfer in low-profile applications.

NeoScale Connectors are next-generation board-to-board interconnect solutions designed to deliver ultra-high-speed, high-density connections for advanced electronic systems. These products achieve up to 56Gbps, doubling the original performance target for next-generation telecommunications and networking applications. Their flexible mezzanine system addresses space constraints with a scalable design that supports a wide range of high-speed signal requirements.

Designed to support advanced systems, SpeedMezz Connectors are high-speed, mezzanine board-to-board solutions with compact and reliable connectivity for data-intensive applications. SpeedStack and SpeedEdge plugs deliver up to 56Gbps, while SpeedField plugs support up to 20Gbps, all sharing the same footprint for easy upgrades. This connector family includes SpeedCable and SpeedFlex assemblies for flexible cabling and short-stack height requirements.

Robust and space-efficient HD Mezz Connectors are high-density, high-speed mezzanine board-to-board solutions that deliver superior performance and compact configurations for demanding applications. Their patented Solder Charge technology offers a more reliable and economical alternative to BGAs, reducing assembly costs. Designed for 100 mating cycles, these connectors ensure consistent performance in high-speed networking and telecom applications.

Delivering robust SI and reliable performance for advanced electronic systems, NeoPress Connectors are press-fit, high-speed board-to-board solutions that support data rates up to 28Gbps. The press-fit compliant-pin design enables solderless termination and easy PCB rework without sacrificing SI performance. Mirror-image triad layout and staggered footprint minimize crosstalk, ensure zero-skew routing and reduce PCB layer count for cost savings.

RoHS-compliant 1.00mm Mezzanine IEEE 1386 Connectors are compact, board-to-board solutions designed to deliver high-speed, reliable connectivity in space-constrained designs meeting the IEEE 1386 standard. Multiple stack heights and up to 84 circuits provide design versatility for complex systems. The UL94V-0 LCP housing withstands SMT reflow, while exceptional tolerance absorption enables secure mating.

IP6K7/IP6K9K-rated CMC and CMX Connectors are high-performance, sealed connectors designed for automotive applications requiring robust and compact solutions for signal and power distribution. These connectors offer wire-to-board and wire-to-wire hybrid connections featuring multiple circuit options with signal, mid-power and power terminal sizes for wire sections from 0.35 to 5.00mm².

Exceeding IP67 and conforming to UL 1977 requirements, the MX150L Connector system features a rugged, sealed design, supporting signal and power applications in harsh environments. A silicone-based mat seal eliminates individual wire seals, reducing assembly complexity and cost. Flexible options include wire-to-wire, wire-to-panel and wire-to-board formats with two pitch designs.

MX150 Connectors are compact, sealed and unsealed connector systems designed for cost-effective, high-performance interconnects in automotive and transportation applications. These connectors have a reduced package size compared to traditional USCAR connectors and support low- and mid-voltage applications for space and weight savings. Mat-seal technology eliminates individual cable seals, reducing size. Multiple plating options are available for robust electrical performance.

Available in three different circuit-size headers, Compactus connectors reduce complexity in procurement and support diverse application designs. These connectors enable increased functions and connectivity in limited spaces for automotive and commercial vehicles.

Certified for harsh environments, MX123 Connectors meet GMW3191 specs, including IP67/IP68/IP69k sealing, Temp Class III and Vibe Class I vibration standards. Mat-seal technology enables one of the smallest packaging sizes available, eliminating individual cable seals and simplifying harness assembly. Precious metal plating stabilizes contact resistance under severe conditions, while center-wall feature supports blind-mate connections and prevents scooping.

High-speed, high-density Impulse Backplane Connectors support scalability and data transmission up to 112Gbps PAM-4 in advanced electronic systems. Ideal for data centers, networking and telecom applications, the Impulse system offers optimized SI, low insertion loss and crosstalk and robust mating interfaces. These connectors enable flexible, scalable configurations that deliver dependable operation and consistent electrical performance.

Offering exceptional SI and scalability for advanced electronic systems, Impel and Impel Plus Backplane Connectors are high-speed, modular connectors that deliver speeds up to 56Gbps and support backward and forward compatibility. The robust interface improves reliability and minimizes installation errors, while cable assemblies using Molex Temp-Flex twinax cable offer complete, high-performance cabled solutions.

Next-generation data and telecommunications systems require scalable, high-speed, high-density interconnect solutions with superior SI. Impact Backplane Connectors support data rates up to 25Gbps, or 28Gbps for Impact zX2, and feature up to 80 differential pairs per inch, enabling system upgrades without architectural redesigns. The mating interface ensures long-term reliability, while multiple configurations and compliant pin options enhance design flexibility.

Supporting data rates up to 12.5Gbps with backward compatibility to standard 6Gbps GbX connectors, GbX I-Trac Backplane Connectors meet evolving bandwidth needs for high speed and exceptional mechanical and electrical performance. The open pin-field architecture provides up to 69 differential pairs per linear inch with flexible pin assignment and a broadside-coupled, skew-equalized system that minimizes crosstalk and insertion loss.

EdgeLine high-speed card edge connectors deliver robust, high-performance interconnect solutions for high-speed data transfer in compact, space-saving designs. They are ideal for telecommunications, data centers, enterprise servers, networking equipment and industrial automation systems requiring reliable, high-speed connectivity at speeds up to 20Gbps. The versatile range of options includes EdgeLine Signal Power (ESP), CoPlanar, CoEdge and CoBridge solutions.

High-performance, high-speed Sliver Edge Card Connectors support data rates up to 32Gbps and are recognized by the Small Form Factor (SFF) Committee, Gen-Z Consortium and Open Compute Project (OCP). The 0.60mm pitch provides 30% space savings compared to conventional 0.80mm solutions, optimizing real estate and delivering scalable and upgradeable memory/storage, accessory cards and orthogonal direct configurations.

The SpeedMezz Connector family of mezzanine and card edge connectors includes 56Gbps SpeedStack and SpeedEdge connectors as well as 20Gbps SpeedField solutions. All share the same footprint, simplifying upgrades and offering versatile stack-height options with 22, 60 and 82 circuits. SpeedCable and SpeedFlex cable assemblies provide added design options, supporting complete system solutions.

EdgeLock Wire-to-Edge Card Connectors provide reliable and compact connectivity solutions that are ideal for designs requiring enhanced mechanical retention and electrical performance. These connectors support high current ratings and ensure solid electrical connections in demanding environments. Tool-free assembly simplifies maintenance while the rugged design enhances durability and minimizes system downtime.

The KickStart Connector System supports data rates up to 32Gbps NRZ and provides a compact, all-in-one I/O solution for cabled boot drives. The SFF-TA-1036-standard KickStart system combines power and signal circuits into one cable assembly, delivering superior SI, minimizing the board footprint and improving cooling efficiency. The robust, low-profile design improves thermal performance and ensures mechanical and electrical reliability.

Ideal for data centers and high-performance computing systems that require ultra-reliable, high-speed internal cable-to-board connectivity, the advanced NearStack Connector System provides high-density, low-profile and high-speed connections. Directly welded wires eliminate paddle cards, improve SI and optimize space. Various interfaces and connector types, including modular and stackable designs, support next-generation data center designs and high-density installations.

The cutting-edge NextStream Connector System is a high-speed internal I/O solution that meets the PCIe 6.0 standard, supporting data rates up to 64Gbps PAM-4. The mechanical design and integrated active redriver channel ensure superior SI performance, while the miniaturized form factor and multiple connector options support a wide range of applications and enhance design flexibility.

Designed for high-speed and high-density near-chip applications, the MicroBeam connector system delivers data rates up to 112Gbps in a low-profile, cabled connector that uses twinax cable to provide exceptional SI. The low-profile connector enhances airflow, minimizes interference with other components, improves design flexibility for near-chip placement and enables more high-speed channels in space-constrained architectures.

The ultra-compact, high-performance Nano-Pitch I/O Connector System offers industry-leading SI and scalability for next-generation data applications. The miniaturized connector footprint supports data rates up to 25Gbps and offers various mounting options that enable high bandwidth in space-constrained systems. Supporting diverse application needs, Nano-Pitch connectors adhere to PCIe, SAS, SATA and future-proofed PCIe 4.0 and SAS-4 standards.

Data centers, enterprise servers and telecommunications systems using PCIe 5.0 data rates require flexible, high-density connectivity. The Multi-Trak connector system is optimized for SI and mechanical reliability, supporting data rates up to 64Gbps and conforming to the SFF-TA-1033 standard. These scalable and modular connectors improve design flexibility, minimize crosstalk and insertion loss, reduce downtime and optimize space in high-density layouts.

Supporting next-generation data rates, the QSFP-DD Connector System is a high-density, high-speed pluggable I/O solution that doubles lane density and enhances SI. The system offers a fully integrated design with optimized connectors, Molex Temp-Flex cables and thermally efficient heat sinks. These connectors work with legacy QSFP cables and modules while supporting 56Gbps PAM-4 and up to 400Gbps aggregate speeds.

The QSFP Connector System is a compact, high-speed, pluggable I/O solution designed to support data rates of up to 400Gbps aggregate for high-density applications. The zQSFP+ design supports up to 112Gbps per lane, meeting requirements for 200G Ethernet and InfiniBand EDR. The connector design ensures insertion loss under 0.8 dB and optimizes thermal management for 5W plugs.

The high-density, high-speed pluggable OSFP Connector System is designed for next-generation applications requiring data rates up to 800Gbps. The connector design enables better airflow, improving cooling at high data rates. OSFP Connectors provide 16 lanes of 224Gbps PAM-4 connectivity with tight tolerance control and grounding that ensure superior SI.

The SFP and SFP+ Connector System offers a compact, high-performance, pluggable interface designed to support data rates of up to 10Gbps for networking and storage applications. Advanced EMI shielding, hot-pluggable transceivers, integrated light pipes for LED status indication, intuitive thumb latches for easy module removal and gold-plating options help ensure reliable operation and simple maintenance.

The advanced, dual-channel SFP-DD 56G PAM-4 connector system delivers high-speed data rates of up to 112Gbps. MT connectors in a tape-and-reel format, together with a wide range of cage mounting options, facilitate easy PCB placement. These connectors support Fibre Channel (8Gbps) and Gigabit Ethernet (10Gbps) applications and offer hot-pluggable transceivers that minimize system downtime.

Delivering high-speed PCIe 6.0 connections, CDFP Connectors provide up to 64Gbps PAM-4 per lane (256Gbps per 16-lane connector) in a compact and scalable form factor. Sturdy EMI shielding and construction ensure stable performance for high-speed applications like AI, GPU and CPU links. The CDFP system is compliant with SFF-TA-1032 and upgradeable to PCIe 7.0, enabling future-proofed designs.

Heavy-Duty Connectors ensure reliable connections for power, signal, pneumatic and data connections in harsh industrial environments. Rugged housings protect against water, dust and vibration while enabling high current and voltage transmission, and meeting industry standards for safety and performance. Modular inserts provide exceptional design flexibility and support customizable configurations for a myriad of applications.

CRC Connectors offer a space-saving solution with up to 50 circuits at about one-fifteenth the size of industry-standard heavy-duty connectors. Support for various mounting styles, configurations and delivery in kit form help simplify design, inventory and ordering work. Spring locks simplify mating and unmating, removable housings streamline field servicing and the modular snap-in design enables tool-free assembly.

The MX150L Connector system features a rugged, sealed format designed for signal and power applications in harsh industrial, marine and commercial vehicle applications. These connectors meet IP67 and UL 1977 standards and offer flexible options such as wire-to-wire, wire-to-panel and wire-to-board configurations. TPA and optional CPA ensure proper assembly and robust reliability in supporting up to 40.0A of current.

Internal memory DIMM Connectors such as DDR3, DDR4, DDR5 and MiniDIMM sockets are designed to meet JEDEC industry standards for diverse memory applications. These connectors provide 6.4Gbps speed, improved performance, power efficiency and space savings with a smaller footprint and low seating plane that maximize PCB real estate and compatibility with demanding memory applications.

High-performance, reliable and cost-effective Serial ATA and Serial Attached SCSI connector systems support networking and storage applications by providing high data transfer rates in multiple configurations. SlimSAS Cable Assemblies deliver 12, 16 and 24Gbps data rates, meeting SAS-3, SAS-4 and PCIe 4.0 standards in a compact form factor for storage, mobile and enterprise applications.

Offering sealed, high-density, hybrid solutions for harsh automotive environments, the CMC/CMX Connector System meets diverse application needs by providing 22 to 154 circuits. These connectors are IP6K7/IP6K9K-rated for extreme conditions and offer TPA and CPA to ensure secure connectivity. CMC/CMX Connectors meet LV214 and USCAR-2 standards and offer multiple polarization, output direction and header options, enabling exceptional design flexibility.

Compactus sealed hybrid connectors enable more functions and connectivity in limited spaces for automotive and commercial vehicles. These connectors are available in various circuit sizes, reducing complexity in procurement and supporting diverse application designs. The Compactus system offers 0.50, 1.00 and 2.80mm terminals in one connector to accommodate varying currents and data rates.

Compact and robust ConnTAK50 Connectors offer up to 22 circuits in a footprint smaller than conventional 0.64mm terminal systems. These connectors use standard 0.50mm AK terminals, support multiple header and wire size options, and offer no-void CPA to improve reliability without increasing the connector size. A patented two-piece beam design ensures vibration resistance and consistent electrical performance.

DuraClik Connectors are compact, reliable wire-to-board connectors engineered for applications requiring rugged durability and electrical performance in harsh environments. An inner positive lock, available ISL and TPA, and up to 100N of PCB retention force ensure consistent performance in high-vibration environments. DuraClik Connectors meet stringent automotive standards such as LV214, ES91500-03 and SAE/USCAR-21.

The H-DAC 64 unsealed connector system delivers secure and reliable data and power transmission in harsh environments, featuring scoop-proof housings, TPA and positive locking to ensure proper mating in high-vibration conditions. These connectors improve design flexibility by offering single- or dual-row options, vertical or right-angle headers and various circuit sizes.

The 0.50mm terminals used in the Mini50 connector system reduce size and weight by up to 50% compared with traditional 0.64mm systems. These high-density connectors provide IP67/IP69K sealing and ISL to ensure reliable operation in harsh automotive environments. Mini50 Connectors meet USCAR 050 standards and offer multiple circuit counts, header orientations and polarization options to minimize design constraints.

Ideal for automotive powertrain applications and high-vibration environments, MX123 sealed connectors meet GMW3191 specifications and Class I vibration standards. Integrated TPA and CPA ensure secure mating, while filtering and precious-metal plating reduce crosstalk and provide robust contact resistance, ensuring superior electrical performance. Multiple orientations, polarization and color-coding options enhance design flexibility and minimize assembly errors.

Compact, high-performance MX150 Connectors provide sealed, unsealed and hybrid solutions in a reduced package size compared to traditional USCAR connectors. A full range of low- and mid-voltage connectors and components support a diverse range of automotive applications and enable a straightforward transition to 48V wiring without major redesigns, reducing engineering costs and improving efficiency.

The MX-DaSH system combines high-speed data, power and signal circuits into one compact connector, minimizing the need for multiple connectors. Modular designs enable flexible integration of diverse systems, simple scalability and streamlined wiring harness designs, reducing complexity across platforms. MX-DaSH Connectors are designed for ease of assembly and optimized for rugged durability in harsh automotive environments.

Modular and stackable Stac64 Connectors are designed to offer scalable solutions for automotive electronics. Supporting signal and power connections, these unsealed connectors enable easy customization without special tooling. Stac64 Connectors are built to USCAR2 Class II standards and feature pre-assembled TPA and alignment strips to reduce labor costs and simplify assembly work.

The stAK50h Connector System eliminates the need for custom tooling by allowing the easy stacking of headers, supporting 12- to 56-circuit power and signal configurations. Color-coded housings simplify assembly while terminals based on NanoMQS and AK specifications ensure broad compatibility with signal and Ethernet applications. This system meets USCAR2 and global automotive standards, streamlining validation and accelerating time to market.

The innovative Flexi-Latch+ Connector combines high reliability, ease of assembly and flat flexible cable (FFC)/flexible printed circuit (FPC) connectivity in a compact package. These miniaturized connectors feature a scoop-proof design, mechanical keying and optional lock features to ensure consistent connectivity. Flexi-Latch+ Connectors also support automated assembly processes and are USCAR-2/LV214-validated to resist shock and vibration in harsh automotive environments.

Addressing increasing demands for high-speed data processing, power distribution and system reliability in vehicle electronics, ZN Stack floating connectors support ultra-fast data rates in a compact footprint. These rugged, reliable high-performance connectors are validated to automotive specifications and combine 32Gbps data connectivity with up to 40.0A of two-way power transfer capability, reducing the need for external power inputs for PCBs.

Low-profile Float-Stack connectors are advanced micro connectors designed to accommodate misalignment and ensure reliable connectivity in high-density automotive applications and other harsh environments. The unique floating mechanism ensures alignment tolerance, supports compact designs and delivers high-speed signal transmission in a rugged form factor that is resistant to vibration and shock forces.

High-density interconnects designed for secure mating and streamlined assembly, CLIK-Mate Connectors are ideal for mobile devices, consumer electronics, automotive systems, industrial equipment and other miniaturized applications. Compact pitch options, versatile configurations and an audible click-lock mechanism simplify high-volume assembly and enable compact and reliable designs without compromising performance.