From the phone in your pocket to the machinery that assembled it, one trend is clear: packing greater functionality into increasingly smaller spaces through miniaturization is on the rise.
Miniaturization is accelerating in virtually every industry, particularly in advanced applications such as RF/wireless devices, consumer electronics and data center/edge computing. While creating smaller assemblies than ever before, designers must contend with greater feature density, greater I/O density and evolving user expectations.
Molex is committed to facilitating the path to miniaturization with decades of experience in navigating its challenges and tradeoffs. Our global team of engineering and manufacturing leaders provides cross-disciplinary expertise and unmatched collaboration to support the changing requirements of our customers. We're focused on providing innovative interconnect solutions that tackle evolving and emerging applications head on, allowing our customers to increase functionality while driving down product sizes.
Read on to learn more about miniaturization trends and problem solvers.
