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Molex Secures Prestigious China Industry Award for Enhanced High-Speed Connectors

Molex, a leading global connectivity and electronics solutions provider, has captured a prestigious IoT Product Award at the recent OFweek 2023 (8th) IoT / AI Conference recently hosted in Shenzhen, China.   

August 28, 2023

Highlights


  • Molex Mirror Mezz Pro and Mirror Mezz Enhanced high-speed connectors win OFweek 2023 (8th) IoT Industry Award
  • Delivers multiple innovative performance advantages for next-generation data centers running artificial intelligence (AI) and high-density applications

Lisle, IL – August 28, 2023 – Molex,  a leading global connectivity and electronics solutions provider, has captured a prestigious IoT Product Award at the recent OFweek 2023 (8th) IoT / AI Conference recently hosted in Shenzhen, China.  

The OFWeek Awards are designed to recognize exceptional products within the IoT and AI sectors in China. Numerous manufacturers, both from China and abroad, submitted their nominations. The evaluation process considered technological innovation, case studies, growth prospects, investment viability, and industry leadership before creating a shortlist for engineers and netizens in China to vote for the top product. Molex Mirror Mezz Pro and Mirror Mezz Enhanced products won the IoT Industry Award, citing a multitude of innovative performance advantages.

"We are proud that Mirror Mezz Pro and Mirror Mezz Enhanced high-speed connectors have been recognized by the panel as well as engineers in China,” said Wai Kiong Poon, New Product Development Manager of Molex. “With the rapid development and adoption of artificial intelligence (AI), big data, intelligent driving, 5G/6G and other technologies in mainland China, the demand for high-speed infrastructure for network servers, data storage and data centers is ever increasing. Mirror Mezz Pro and Mirror Mezz Enhanced high-speed connectors were uniquely developed to meet this market demand for high-speed applications.”

Mirror Mezz Pro Connectors offer design flexibility with a self-mating feature and are recognized as the Compute Project (OCP) standard board-to-board solution for accelerator cards. They also support data speeds up to 112 Gbps. Mirror Mezz Enhanced extends the capabilities of Mirror Mezz Pro and supports 224 Gbps. Both connectors deliver superior signal integrity performance and data speeds, addressing ever-increasing data transmission requirements for telecommunications, networking and other high-density applications.

The global manufacturing capability of Molex, along with, robust engineering support and complementary Mirror Mezz-compatible products, such as copper flex and high-performance cables, all deliver a unique combination of compactness, performance and design flexibility. 

The award ceremony was co-hosted during the OFweek Global Digital Economy Industry Conference that also includes the 5th International Workshop on Artificial Intelligence and Education, the OFweek IoT and Artificial Intelligence Industry Conferences 2023.

For more information on the Mirror Mezz series of high-speed connectors, please visit: https://www.molex.com/en-us/products/connectors/board-to-board-connectors/mirror-mezz-mirror-mezz-pro-connectors.

 

 

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Molex is a global electronics leader committed to making the world a better, more-connected placeWith a presence in more than 40 countries, Molex enables transformative technology innovation in the automotive, data center, industrial automation, healthcare, 5G, cloud and consumer device industries. Through trusted customer and industry relationships, unrivaled engineering expertise, and product quality and reliability, Molex realizes the infinite potential of Creating Connections for Life

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