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Impress Co-Packaged Copper Solution mounted to a PCB.

Impress Co-Packaged Copper (CPC) Solution

Engineered to provide ultra high-speed data transmission that meets the needs of next-generation data centers, Impress Co-Packaged Copper Solutions include a compression-based substrate connector and mating cable assembly that support data rates of 224Gbps PAM-4 and beyond. The high-density Impress system uses 30 AWG twinax wires to deliver exceptional signal integrity, scalable density, efficient power delivery and robust durability in a compact form factor.

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Data Rates Circuits Wire Gauge Current
224G+ PAM-4 Banks of 32 differential pairs (DPs) up to 128 or 512 DPs 30 AWG twinax 0.5A per DP

Features and Benefits

The increasing use of AI is driving demand for ever-greater data transmission speeds of 224Gbps PAM-4 and beyond. Data centers must meet these needs with connectivity solutions deliver data to the chip in a compact, scalable form factor that ensures exceptional signal integrity, durability and reliability over multiple mating cycles and long operational lifetimes.

Cabled, connectorized solutions that use on-substrate connections to shorten signal paths through the PCB enable efficient and reliable high-speed data transmission. The use of two-piece systems improves maintenance, while high-density designs optimize space and enhance scalability, helping future-proof systems for next-generation data rates.

Impress Co-Packaged Copper Solutions provide a cable-based, connectorized data transmission system that optimizes signal strength by delivering an on-substrate connection to the ASIC. High-performance twinax cable and connector shielding help minimize signal loss and crosstalk. The robust compression-attached socket helps prevent damage to the substrate, reducing costs and improving signal integrity and reliability. The Impress system helps future-proof data center architectures by enhancing scalability and upgradability, with 224Gbps PAM-4 capability or faster, in a versatile, high-density circuit layout.

High-Density On-Substrate Interconnect Technology

By moving the cable connection onto the substrate, the high-density Impress system minimizes the distance that high-speed signals must travel, bypassing the motherboard for direct routing to the backplane or I/O. This innovative technology enhances signal integrity and reduces the opportunities for crosstalk and signal loss.

Impress co-packaged copper connector with twinax cable connections.

Compression Interface for Reliable Substrate Contact

The Impress socket is compression-attached to the substrate, eliminating the need for surface-mount technology (SMT). This helps prevent damage to the delicate and expensive substrate, improves signal integrity, streamlines cable removal or maintenance, and avoids the need for screw holes in the substrate.

Impress co-packaged copper sockets compression-attached to the substrate.

Secure Mechanical Retention for High-Performance Systems

The robust retention hardware of the Impress system ensures rugged and reliable connectivity, while the overmolded cable strain relief and mechanical contact wipe features improve mechanical durability.

Exploded view of the Impress Co-Packaged Copper Solution showing the retention hardware.

Optimizes high-speed signal integrity
On-substrate connectors minimize the distance signals must travel through the substrates, interconnects (such as ball grid arrays) and motherboard PCBs. This provides a finely tuned, full-channel solution that ensures complete isolation from the substrate to the interconnect, reducing signal loss and crosstalk.

Protects the substrate surface
The compression socket interface avoids the need for screws through holes in the substrate and directs the wrench or cable routing force away from the substrate, helping prevent substrate damage.

Improves re-workability
The two-piece connectorized system uses a compression-mounted socket, removing the need for SMT attachment and simplifying maintenance.

Ensures proper cable support
Overmolded strain relief helps prevent damage to the twinax cable, connector or substrate during assembly.

Enhances mating cycle durability
The mechanical wipe improves long-term reliability and permits more mating cycles without affecting system operation.

Datasheets and Guides

Applications by Industry

This is not a definitive list of applications for this product. It represents some of the more common uses.

Frequently Asked Questions

What is the Impress Co-Packaged Copper Solution?

The Impress Co-Packaged Copper Solution is an advanced, compression-based substrate connector and mating cable assembly designed for AI data centers and high-density interconnect applications. The Impress system supports data rates up to 224Gbps PAM-4 or faster, delivering exceptional signal integrity, reliable electrical performance and scalable density for ultra high-speed applications. Impress connectors feature banks of up to 128 differential pairs, for a total solution of 512 or 1,024 DPs (256 DPs in development); high-quality 30 AWG twinax wiring (32 AWG in development); and a compact form factor with a mated height as low as 15.00mm, enabling high circuit density and superior design flexibility to support evolving system complexity.

What makes the Impress Co-Packaged Copper Solution different from the competition?

The Impress system is a finely tuned, full-channel solution that ensures complete isolation from the substrate to the interconnect. This product is unique in that its development leverages previous experience with Molex on-the-substrate products such as NearStack OTS, providing users with the benefits of this expertise.

What are the Impress system contact pitch specifications?

The contact pitch is 2.00mm between DPs and 1.60mm between rows.

How does the Impress Co-Packaged Copper Solution create value for manufacturers?

The Impress system enables data centers to meet AI-driven demands for increased capacity by delivering near-ASIC connectivity that optimizes signal integrity at high data rates. The durable compression-based connector and serviceable cable assemblies that protect the substrate help simplify maintenance and scalability, allowing data centers to make upgrades and repairs without affecting the expensive substrate. The high-density, twinax cable-based connection improves signal reliability, reduces downtime, simplifies upgrades and enhances system flexibility.

What are the benefits of compression attachment to the substrate?

By avoiding SMT attachment, the compression-attached Impress socket reduces the effects of warping and helps prevent heat damage that can adversely affect signal integrity and substrate strength. Compression attachment also improves upgradability and scalability by avoiding the need for screw-attachment holes in the substrate.

Is the Impress system upgradeable to 336G or 448G speeds?

Development work is currently underway to validate the Impress system for use with 336G or 448G applications. Development work is currently underway to validate the Impress system for use with 336G or 448G applications.