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Hyperscale Data Center Connectivity Solutions

A more connected world is driving exponential growth in data generation and consumption. Acting as the heart of this connectivity is an evolving network of hyperscale data centers. These expansive sites prioritize density, scalability and modularity to serve bandwidth-intensive applications stemming from the internet of things (IoT), streaming, artificial intelligence (AI), machine learning, 1.6T networking and other high-speed applications.

Molex is an innovator in hyperscale data center solutions, leading developments in next generation PCIe technology and introducing a first-to-market comprehensive portfolio of 224 Gbps-PAM4 products and custom architecture designs.

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The Future of Hyperscale Connectivity

Today, more than 504 hyperscale data centers are in development worldwide. In the United States alone, hyperscale capacity is expected to nearly triple by 2030. This growth puts pressure on system architects to expand existing resources and build new infrastructure to meet the demands of bandwidth-intensive, low-latency applications such as AI, real-time data processing and edge computing.

This expansion comes with significant challenges, including the need to address interoperability, space utilization and thermal management. Modular data centers enable interoperability by facilitating quick and efficient deployment, allowing for seamless compatibility and expansion. High-density servers and storage solutions maximize compute power per square foot, addressing the growing need for efficient space utilization. Innovative technologies, including liquid cooling and immersion cooling, are also increasingly employed to manage heat more effectively and reduce energy consumption.

Molex plays a pivotal role in this evolving landscape by offering modular and scalable infrastructure solutions that rapidly adapt to changing demands for faster time-to-market and deployment. Through close co-development with customers, Molex works hand-in-hand with system architects to advance their specific development needs and drive the next era of hyperscale. 

Core Hyperscale Connectivity Design Challenges

High-Density Computing

As hyperscale data centers handle growing volumes of data, optimizing computational power within a limited space becomes a main objective. By leveraging connector solutions optimized for space and flexibility, hyperscale system architects can achieve higher server densities and improved performance. 

For example, Mirror Mezz hermaphroditic connectors are engineered to provide superior signal integrity across variable stack heights while the NearStack PCIe Connector System eliminates the paddle card to reduce space requirements. The Kickstart Connector System integrates both power and signal circuits into a single, low-profile cable assembly. Similarly, the NextStream Connector System supports PCIe Gen 6 speeds in a compact, low-mating height package.

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Scalability

Hyperscale facilities must maintain high performance on existing operations while rapidly scaling infrastructure to meet the growing demand for data. By leveraging preconfigured modules that allow for swift adaptation based on specific workload requirements, data centers can upgrade assets without slowing down.

As an active participant in the Open Compute Project (OCP) and a member of multi-source agreement (MSA) committees, Molex demonstrates its commitment to standardized approaches that promote fast deployment and efficient time-to-market. With modular solutions, data centers can seamlessly adapt to escalating workloads, ensuring robust performance and reliable operations. 

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Thermal Management

As processing power increases, hyperscale data centers must integrate components that support effective thermal management.

Molex delivers innovative solutions for I/O modules, including drop-down heat sinks, Inception Backplane solutions, smaller-diameter twinax cables and VaporConnect Optical Feedthrough Modules. Consult our recent report to examine the drawbacks of established thermal management approaches and how new innovations can help solve modern problems.

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Energy Consumption

Hyperscale data centers consume vast amounts of energy to sustain operations. Coupled with ambitious sustainability goals, increasing demand pushes facilities to adopt more efficient and adaptable power distribution frameworks. This need extends to reliable interconnect solutions that are compatible with the latest cooling technologies.

Molex addresses these challenges with OCP-compliant PowerPlane Busbar Connectors and VaporConnect Optical Feedthrough Modules. PowerPlane connectors support flexible power-distribution architectures and deliver proven reliability even in advanced liquid-cooling environments. VaporConnect Modules help lower energy consumption by reducing overheating, cutting fan speeds and driving down overall power costs.

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Copper Interconnects in the Age of 224G

To support the exponential growth of data and processing power in hyperscale infrastructure, high-speed copper interconnects still play a sizable role. Learn how they are offering unparalleled speed, cost-efficiency and reliability.

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Resources for Hyperscale Connectivity

WHITE PAPER

Modulation Techniques for 448G Data Center Channels

Achieving 3.2Tbps per port is the next major target in hyperscale data center performance. Based on a joint study by Molex and a leading semiconductor company, our whitepaper explores two bandwidth-scaling paths: doubling 224G lanes and upgrading to 448G per lane. Learn more about the results of the study, including the trade-offs each path presents in terms of density, power draw, signal integrity and thermal management. 

EVALUATE PATHS TO HYPERSCALE
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Top Data Center Trends for 2025

In 2025, hyperscale data center operators need to focus on deploying higher-density fiber and innovative cooling methods to manage the rapid increase in data and power demand driven by AI and other advanced technologies. 

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Top Data Center Trends for 2025 

Building Blocks of High-Performance Computing

Data centers are continually striving to upgrade computing performance while making the most of their current infrastructure. Modular hardware solutions for high-performance computing (HPC) from Molex provide a strategy for rapid scalability, effective thermal management and space optimization.

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Server Compute PCIe

224 Gbps-PAM4 High-Speed Data Center Technology

New data rates are poised to reinvent industries from automotive to quantum computing and genomics. Integrating 224 Gbps interconnects while managing signal integrity and thermal loads is key to successful implementation. Molex industry-leading interconnect solutions address these challenges head-on, helping to power the hyperscale data centers of today — and tomorrow. 

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The Continuing Evolution of PCIe

Emerging high-performance applications from AI to AR are placing unprecedented demands on data center technologies. To keep up, system architects need high-speed, low-latency and highly scalable solutions. Explore how PCIe has evolved over the generations and how Molex has been at the forefront of PCIe Gen 5, 6 and even 7. 

Explore PCIe Solutions

BLOG

Expanded Beam Optical Connectors for Next-Generation Data Centers 

Data centers are scaling at unprecedented speeds, but traditional fiber connectors can slow deployment and increase risk. VersaBeam Expanded Beam Optical (EBO) Interconnects remove those barriers, enabling faster builds, denser designs and smarter growth. With EBO, hyperscale infrastructure can expand more efficiently to meet the demands of AI and beyond.

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Featured Videos

VersaBeam EBO versus MPO Connectors 

Cleaning and inspecting traditional multi-fiber MPO connectors are time-consuming and slow deployment. EBO technology helps solve these problems, minimizing dust sensitivity and simplifying inspection while improving overall fiber performance. VersaBeam EBO Connectors offer a true plug-and-play design that accelerates deployment, reduces downtime and supports reliable operation at scale.

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