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QSFP-DD Connector System

Supporting the continuing growth in the bandwidth demand and datacenter traffic driven by networking and AI/ML requirements, the QSFP-DD (Double Density) Interconnect System delivers 8 lanes with up to 28 Gbps NRZ or 56 Gbps-PAM4 (up to 400 Gbps aggregate) in a compact footprint that is backward compatible with QSFP connectors providing flexibility for end users and system designers.

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Data Rate
200 to 400 Gbps Ethernet and Infiniband EDR
400G OpenZR+ QSFP-DD Pluggable Optical Module (MSA)

High-Speed I/O Connectors

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High-Speed EMI Cages

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Stacked Products

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High-Speed I/O Cable Assemblies

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Optical Cables

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Features and Benefits

Telecommunication and data center customers have increasing bandwidth requirements and, therefore, require high-density interconnects. QSFP-DD Interconnect System enables faceplate density equal to the current 2x1 QSFP form factor, but with 8-lane ports. In other words, a total of 256 differential pairs with 32 ports delivers double-lane density within the same form factor.

Customers can upgrade their box in advance of new cables, and their infrastructure won’t be idle while they wait for cables to be built. QSFP-DD Interconnect System supports legacy cables as well as upgraded plugs. The MSA had defined:

  • QSFP-DD Module form factor
  • 2-by-1 cage and connector form factor
  • 1-by-1 cage and SMT connector form factor
  • Pinout and management interface
  • 112G PAM-4 or 800G aggregate products have a different PCB footprint, but continue to support backwards compatibility with all MSA complaint QSFP and QSFP-DD modules

Stacked integrated connectors and cages are available in 2-by-1 configuration:

  • Supports pluggable applications

28 Gbps NRZ and 56 Gbps PAM-4:

  • Meets or exceeds current requirements for 200-Gigabit Ethernet and InfiniBand 100-Gigabit (EDR) applications
  • Supports legacy 10 Gbps Ethernet, 14 Gbps (FDR) InfiniBand and 16 Gbps Fibre Channel applications

Fully integrated design:

  • Incorporates all components (backshells, cable, populated PCBs) from Molex
  • Ensures high-quality components are compiled into a comprehensive solution with a superior cost structure

0.80mm-pitch host connector designed for placement beneath EMI cage:

  • Supports pluggable applications

Identical mating interface as the QSFP+ connector for backward compatibility:

  • Protects end user's current QSFP+ infrastructure investment

Temp-Flex cable technology:

  • Boosts electrical performance
  • Provides excellent operational margin, short lead times and minimal end-user cost via manufacturing efficiencies

Nickel-plated heat sink:

  • Provides increased thermal transfer from module to heat sink

Preferential coupling design uses a narrow-edge coupled, blanked- and formed-contact geometry and insert molding:

  • Provides superior signal integrity (SI) performance, including extremely low insertion loss (IL)

Cable Assemblies Meet IEEE 802.3bj, InfiniBand EDR and SAS 3.0 specifications:

  • Functions across a wide variety of next-generation technologies and applications

Datasheets and Guides

Applications by Industry

Servers
Storage

Cellular infrastructure
Central Office equipment
Multi-platform service systems (DSL, cable data)
Routers
Servers
Switches

This is not a definitive list of applications for this product. It represents some of the more common uses.