Back to Industries & Applications
Product Highlights
Application: | Current: | Operating Temperature: |
---|---|---|
TOR to Server Interconnect | 0.5A | -40 to +85°C |
Features and Benefits
Overview
To keep up with evolving bandwidth requirements, new high-end switch chips offer up to 256 lanes that utilize QSFP-DD Interconnects at the TOR (top-of-rack) switch. This also leads to higher lane count connections required for the server. The SFP-DD Module System offers a focused two-lane interconnect at the server to accommodate higher lane count QSFP-DD TOR interface, enabling networking and server equipment to take full advantage of its high density. It also supports break-out cables in denser applications.
There are no common 2-lane pluggable I/O solutions in today’s market. The SFP-DD Interconnect is a standardized system developed by an MSA group to address the technical challenges of achieving a double-density interface while ensuring mechanical interoperability for module components products by different manufacturers.
Thermal management for current SFP form factors is limited to connectors that generate 1.5W. Therefore, heat becomes an issue with connectors that generate 3.5W. SFP-DD Cages employ a longer structure, which creates more area to dissipate heat. This offers effective 3.5W thermal management to ensure superior signal integrity (SI) performance.
Applications by Industry
This is not a definitive list of applications for this product. It represents some of the more common uses.