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Overcoming Data Center Ethernet Switch Challenges with Advanced Interconnects
For data centers to meet the demands of high-speed, data-intensive applications and avoid bottlenecks, switches need to support lower latency and increased throughput. Additionally, physical space constraints often require switches and components to optimize port density and maintain compact designs. Efficient heat dissipation across the system is also critical for ensuring long-term operational reliability.
Advanced interconnects and high-performance cabling deliver the bandwidth and low latency required for next-generation data rates. High-density connectors, like QSFP-DD and SFP-DD, allow for greater port density in limited spaces. To manage heat dissipation and maintain system stability, system designers look to liquid cooling and heat sinks as effective solutions.
Molex provides the advanced Ethernet switch components that overcome these obstacles, supporting the latest standards like PCIe Gen 6 and Ethernet 224Gbps PAM4. With superior signal integrity (SI) even at high frequencies, compact form factors and innovative thermal management options, Ethernet switch components from Molex empower data centers to perform at peak efficiency.
Featured Products
High-Speed Internal I/O Connectors
As data rates increase, maintaining signal integrity becomes critical for handling high frequencies without loss or distortion. High-density connectors from Molex are designed to support leading-edge standards like PCIe Gen 6 and 224Gbps PAM4, to support reliable signal integrity and high-speed performance across complex data environments.
PCIe Gen 4 16Gbps |
PCIe Gen 5 32Gbps |
PCIe Gen 6 64Gbps |
PCIe Gen 7 128Gbps |
Industry Standard | |
---|---|---|---|---|---|
NextStream Connector System | x | x | SFF-TA-1035 | ||
NearStack PCIe Connector System | x | SFF-TA-1026 | |||
NearStack HD Connector System | x | ||||
Multi-Trak I/O Connectors | x | x | SFF-TA-1033 | ||
SAS Connector System | x | x | SFF-TA-8654 | ||
Sliver Edge Card Connectors | x | x | SFF-TA-1002 |
Speed | Current | Differential Pairs | Mated Height | |
---|---|---|---|---|
MicroBeam Connectors | 112Gbps | 0.75A per pin | 12, 16 | Less than 7.00mm |
External I/O Connectors
Future-proofing data center infrastructure requires external I/O components that can scale with increasing demands for port density and bandwidth. Molex’s External I/O Solutions—compatible with Ethernet, Infiniband and PCIe applications—support data rates from 10G to 224G PAM4, offering the flexibility and performance needed for seamless upgrades and long-term scalability.
Data Rate (per Lane) | Aggregate Speed | External Cable | |
---|---|---|---|
OSFP Connector System | 56, 112, 224Gbps | Up to 1600Gbps | DAC, AOC, ACC/AEC |
QSFP-DD Connector System | 28, 56, 112Gbps | Up to 800Gbps | DAC, AOC, ACC/AEC |
CDFP Connector System | 16, 32, 64Gbps | Up to 400Gbps | DAC, AOC |
QSFP Connector System | 28, 56Gbps | Up to 400Gbps | DAC, AOC, ACC/AEC |
SFP-DD Connector System | 28, 56Gbps | Up to 112Gbps | DAC |
zSFP Connector System | 28, 56Gbps | Up to 56Gbps | DAC |
BiPass I/O Connector System
Maintaining high-speed data processing and low latency switching requires minimizing signal degradation. Molex BiPass Solutions replace lossy PCBs with high-speed twinax cabling, reducing insertion loss and boosting signal integrity. This innovative approach provides a reliable, thermally efficient solution, allowing data centers to handle increasing traffic demands and achieve optimal performance.
Data Rate | Near ASIC Connector | Differential Pairs | |
---|---|---|---|
QSFP-DD Connector System | 56Gbps | NearStack | 8, 16 |
112Gbps | Microbeam | 16 | |
QSFP Connector System | 56Gbps | NearStack | 8 |
Backplane Connectors
High-speed Ethernet switches require robust backplanes capable of handling large amounts of data traffic across all switch ports without creating bottlenecks. Versatile backplane solutions from Molex, featuring advanced signal interfaces and cabled designs, provide superior performance and scalability while addressing challenges like signal degradation and impedance mismatches.
Signal Speed | PCIe Generation | Impedance | Application Orientation | Differential Pairs/in² | |
---|---|---|---|---|---|
Impulse Connectors | 112Gbps |
|
90 Ohms | Backplane, Daughtercard, Orthogonal Direct |
101 |
Impel Plus Connectors | 56Gbps | PCIe Gen 5 | 90 Ohms | Daughtercard, Coplanar, Vertical header, Cable | 48 to 192 |
Impact Connectors | 25 to 40Gbps
|
PCIe Gen 4
|
85, 90, 100 Ohms
|
Backplane, Coplanar, Daughtercard, Orthogonal, Orthogonal direct, Orthogonal Midplane
|
80
|
Mezzanine Connectors
With increasing bandwidth demands, engineers are under pressure to design space-efficient Ethernet switches. Molex Mirror Mezz Connectors, featuring a modular hermaphroditic design, provide compact, high-density interfaces that support high-speed performance and minimize the overall footprint.
|
Data Rate | Stack Height | Differential Pairs |
---|---|---|---|
MirrorMezz Connectors | 112Gbps | 5.00, 8.00, 11.00mm | Up to 270 |
MirrorMezz Pro Connectors | 112Gbps | 5.00, 8.00, 11.00mm | Up to 270 |
MirrorMezz Enhanced Connectors | 224Gbps | 5.00, 8.00, 11.00mm | Up to 270 |
High-Power Solutions
Data center applications require reliable power delivery to prevent operational disruptions. Built with design flexibility in mind, high-power connectors from Molex minimize voltage drop, helping to ensure consistent performance over time.
Current | Pitch | Voltage | |
---|---|---|---|
2.5 - 60.0A | 2.00 - 7.50mm | 600V AC/250V DC |
Current | Plating | Operating Temperature | |
---|---|---|---|
Busbar Solutions | Tin, Nickel, Silver | ||
EXTreme Guardian Connectors | 80.0A | Gold | -40° to +105°C |
PowerPlane IT Gear Connectors | 100.0A+ | Silver | -40° to +125°C |
PowerWize Connectors | 190.0A | -40° to +125°C |