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High-Performance Ethernet Switch Connectors

As data centers evolve, the demand for high-speed performance, reliable signal integrity and efficient heat management in Ethernet switches continues to grow. Navigating these challenges while maximizing port density requires innovative interconnect solutions. Molex delivers advanced technologies that enhance signal performance and optimize thermal efficiency, aligned with the next generation of networking infrastructure.

Overcoming Data Center Ethernet Switch Challenges with Advanced Interconnects


For data centers to meet the demands of high-speed, data-intensive applications and avoid bottlenecks, switches need to support lower latency and increased throughput. Additionally, physical space constraints often require switches and components to optimize port density and maintain compact designs. Efficient heat dissipation across the system is also critical for ensuring long-term operational reliability. 

Advanced interconnects and high-performance cabling deliver the bandwidth and low latency required for next-generation data rates. High-density connectors, like QSFP-DD and SFP-DD, allow for greater port density in limited spaces. To manage heat dissipation and maintain system stability, system designers look to liquid cooling and heat sinks as effective solutions.

Molex provides the advanced Ethernet switch components that overcome these obstacles, supporting the latest standards like PCIe Gen 6 and Ethernet 224Gbps PAM4. With superior signal integrity (SI) even at high frequencies, compact form factors and innovative thermal management options, Ethernet switch components from Molex empower data centers to perform at peak efficiency.


High-Speed Internal I/O Connectors


As data rates increase, maintaining signal integrity becomes critical for handling high frequencies without loss or distortion. High-density connectors from Molex are designed to support leading-edge standards like PCIe Gen 6 and 224Gbps PAM4, to support reliable signal integrity and high-speed performance across complex data environments.

  PCIe Gen 4
16Gbps
PCIe Gen 5
32Gbps
PCIe Gen 6
64Gbps
PCIe Gen 7
128Gbps
Industry Standard
NextStream Connector System     x x SFF-TA-1035
NearStack PCIe Connector System     x   SFF-TA-1026
NearStack HD Connector System     x    
Multi-Trak I/O Connectors   x x   SFF-TA-1033
SAS Connector System x x     SFF-TA-8654
Sliver Edge Card Connectors x x     SFF-TA-1002
  Speed Current Differential Pairs Mated Height
MicroBeam Connectors 112Gbps 0.75A per pin 12, 16 Less than 7.00mm

External I/O Connectors


Future-proofing data center infrastructure requires external I/O components that can scale with increasing demands for port density and bandwidth. Molex’s External I/O Solutions—compatible with Ethernet, Infiniband and PCIe applications—support data rates from 10G to 224G PAM4, offering the flexibility and performance needed for seamless upgrades and long-term scalability.

  Data Rate (per Lane) Aggregate Speed External Cable
OSFP Connector System 56, 112, 224Gbps Up to 1600Gbps DAC, AOC, ACC/AEC
QSFP-DD Connector System 28, 56, 112Gbps Up to 800Gbps DAC, AOC, ACC/AEC
CDFP Connector System 16, 32, 64Gbps Up to 400Gbps DAC, AOC
QSFP Connector System 28, 56Gbps Up to 400Gbps DAC, AOC, ACC/AEC
SFP-DD Connector System 28, 56Gbps Up to 112Gbps DAC
zSFP Connector System 28, 56Gbps Up to 56Gbps DAC

BiPass I/O Connector System


Maintaining high-speed data processing and low latency switching requires minimizing signal degradation. Molex BiPass Solutions replace lossy PCBs with high-speed twinax cabling, reducing insertion loss and boosting signal integrity. This innovative approach provides a reliable, thermally efficient solution, allowing data centers to handle increasing traffic demands and achieve optimal performance.

  Data Rate Near ASIC Connector Differential Pairs
QSFP-DD Connector System 56Gbps NearStack 8, 16
112Gbps Microbeam 16
QSFP Connector System 56Gbps NearStack 8

Backplane Connectors


High-speed Ethernet switches require robust backplanes capable of handling large amounts of data traffic across all switch ports without creating bottlenecks. Versatile backplane solutions from Molex, featuring advanced signal interfaces and cabled designs, provide superior performance and scalability while addressing challenges like signal degradation and impedance mismatches.

  Signal Speed PCIe Generation Impedance Application Orientation Differential Pairs/in²
Impulse Connectors 112Gbps  

 

90 Ohms

Backplane, Daughtercard, Orthogonal Direct

101

Impel Plus Connectors 56Gbps PCIe Gen 5 90 Ohms Daughtercard, Coplanar, Vertical header, Cable 48 to 192
Impact Connectors 25 to 40Gbps

 

PCIe Gen 4

 

85, 90, 100 Ohms

 

Backplane, Coplanar, Daughtercard, Orthogonal, Orthogonal direct, Orthogonal Midplane

 

80

 

Mezzanine Connectors


With increasing bandwidth demands, engineers are under pressure to design space-efficient Ethernet switches. Molex Mirror Mezz Connectors, featuring a modular hermaphroditic design, provide compact, high-density interfaces that support high-speed performance and minimize the overall footprint.

 

 

Data Rate Stack Height Differential Pairs
MirrorMezz Connectors 112Gbps 5.00, 8.00, 11.00mm Up to 270
MirrorMezz Pro Connectors 112Gbps 5.00, 8.00, 11.00mm Up to 270
MirrorMezz Enhanced  Connectors 224Gbps 5.00, 8.00, 11.00mm

Up to 270

High-Power Solutions


Data center applications require reliable power delivery to prevent operational disruptions. Built with design flexibility in mind, high-power connectors from Molex minimize voltage drop, helping to ensure consistent performance over time.

  Current Pitch Voltage

EXTreme TEN60 Connectors

2.5 - 60.0A 2.00 - 7.50mm 600V AC/250V DC
  Current Plating Operating Temperature
Busbar Solutions   Tin, Nickel, Silver  
EXTreme Guardian Connectors 80.0A Gold -40° to +105°C
PowerPlane IT Gear Connectors 100.0A+ Silver -40° to +125°C
PowerWize Connectors 190.0A    -40° to +125°C