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Impel/Impel Plus Backplane Connectors

Impel and Impel Plus Backplane Connectors and Cable Assemblies deliver industry-leading signal integrity, density and data rates up to 56 Gbps while enabling backward and forward compatibility.

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Product Highlights

Signal Speed: Density: Impedance:
40, 56 Gbps8090 Ohms

PCB Headers

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PCB Receptacles

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High-Speed I/O Cable Assemblies

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Features and Benefits

Impel and Impel Plus Backplane Connector System

Compact, compliant-pin backplane connector
(Impel: 25 to 40 Gbps; Impel Plus: 56 Gbps):
Enables backward and forward compatibility with various high-end architectures

90 Ohms nominal Impendence:
Minimizes impedance discontinuities

Multiple pitch options available:
Offers printed-circuit-board designers the flexibility to quad route the signal traces (two pairs per layer) reducing the PCB layer count

Grounding tail aligner for lead frames and wafer shields closer to daughtercard launch to improve ground return path:
Minimizes impedance discontinuities. Reduces crosstalk

Impel

Staggered header-pin interface:
- Provides robust mechanical isolation from the signal pins
- Mitigates the concern for bent pins in the field
- Provides first-mate-last-break capabilities

Impel Plus

Innovative signal beam interface:
- Improves insertion loss compared to in-line signal beams
- Pushes interface resonance frequency past 30 GHz

Small compliant pin (0.31mm ± -0.05):
Reduces crosstalk by enabling optimized routing or use of pinning

Cable assemblies with Temp-Flex Twinax Cables (28 or 30 AWG):
Achieves data rates required by telecommunications and data center industries

Custom cable assemblies

Impel and Impel Plus Connector System full channel solution:
Provides design flexibility per application specifications

Fully automated production line and testing:
- Ensures repeatable high-speed cable production
- Safeguards consistent quality and signal integrity performance across broad frequency bands

Molex patent-pending Impel Connector technology with tightly coupled differential-pair structure:
 Provides optimal signal integrity and mechanical isolation through the connector system

Overview

The Impel Backplane Interconnect System provides the footprint and interface that enables customers to migrate to data rates up to 40 Gbps, without completely re-designing their architecture or replacing hardware already placed in the data-center, while meeting the mechanical density requirements being driven by the industry.

Impel Plus Backplane Connector System achieves data rates up to 56 Gbps while delivering optimal signal integrity with grounding tail aligner that minimizes impedance discontinuities and reduces crosstalk. Additionally, an innovative signal interface improves insertion loss over in-line beams, pushing frequencies past 30 GHz.

Prototyping cable assemblies requires tooling. Therefore, costs generated to prototype a system can be significant. Impel and Impel Plus Backplane Cable Assemblies solve tooling start-up costs by providing a completed assembly.

Once prototyping is complete, customers typically need to create drawings and assign resources to find a supplier to build cable assemblies for end products. Molex builds cable assemblies to provide one-source solutions. This eliminates customers’ design requirements and the need to find another vendor to build assemblies.

Applications by Industry

Storage

Patient Monitor

Routers and switches
Servers

This is not a definitive list of applications for this product. It represents some of the more common uses.

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