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Connectivity Solutions for Smart Devices
Smart device manufacturers face growing challenges as they innovate. The demand for smaller devices with more features drives the need for miniaturization without sacrificing performance and capability. Consumers now expect water resistance, drop protection and longer battery life as standard, while the integration of 5G technology adds complexity with advanced antenna and power management requirements. The rise of foldable displays introduces further engineering challenges, such as heat dissipation and the need for lightweight, flexible and reliable components.
Overcoming these challenges requires next-generation solutions that balance performance and innovation. Flexible circuits and printed electronics reduce size and weight while enabling unique design features. Multi-band antennas ensure high-speed 5G connectivity and power-efficient components address battery and heat management. For foldable devices, advanced hinge designs and flexible connectors provide durability and seamless operation under repeated use.
Molex solutions address these diverse needs with ultra-compact connectors for space efficiency, rugged designs for durability, high-frequency connectors for reliable 5G data transfer and flexible connectors for foldable devices. With a focus on future innovation and reliability, Molex empowers manufacturers with next-gen products that meet user demands for performance, durability and advanced functionality.
Featured Products
Display Connectors
The growing demand for larger, more versatile displays challenges manufacturers to integrate innovative designs without increasing device size. Advanced solutions like miniaturized connectors support foldable and dual-screen designs, enabling immersive viewing experiences for media consumption, gaming and multitasking. Molex offers ultra-compact quad-row connectors for feature-rich devices and flexible connectors like FPCs, which provide reliable performance and durability in foldable smart devices.
Configuration | Pitch | Circuits | Current (Max.) | |
---|---|---|---|---|
Quad-Row Connectors | Board-to-board | 0.175mm | 20, 32, 36, 64 | 0.3A |
SlimStack Connectors | Board-to-board | 0.35 to 1.25mm | 6 to 240 | 18.0A |
FFC/FPC Connectors | Wire-to-board | 0.20 to 2.00mm | 2 to 120 | 2.0A |
RF Connectors
Integrating 5G technology involves ensuring reliable data transmission, reducing interference and meeting consumer demands for faster downloads and smoother streaming. Advanced antenna and connector solutions ensure high-frequency performance and robust connectivity for enhanced user experiences. High-frequency connectors, designed by Molex to handle 5G speeds, also provide shielding to minimize EMI and protect against RF contact buckling and shock.
Configuration | Pitch | Intermediate | |
---|---|---|---|
5G mmWave RF Flex-to-Board Connectors | Signal: 2 to 4, Ground: 4 to- 6, Power: 4 to 0 | 0.35mm | 15 GHz, 25 GHz |
Camera, Speaker and Microphone Connectors
The rise of multi-lens systems, enhanced low-light performance and AI-driven photography challenge manufacturers to integrate advanced sensors and processing power into smart devices. High-speed connectors ensure rapid data transfer to support high-definition imaging, video and audio capabilities. Molex delivers ultra-small connectors designed for efficient data transfer in multi-lens camera systems, enabling cutting-edge performance in smart devices.
Configuration | Pitch | Circuits | Current (Max.) | |
---|---|---|---|---|
Quad-Row Connectors | Board-to-board | 0.175mm | 20, 32, 36, 64 | 0.3A |
FFC/FPC Connectors | Wire-to-board | 0.20 to 2.00mm | 2 to 120 | 2.0A |
Memory Module Connectors
Smart devices rely on durable and reliable connectivity to deliver the seamless performance users expect in any environment. Advanced connector designs incorporate features like locking mechanisms, interior armor and IP-rated protection to withstand daily wear and environmental challenges. Molex designs rugged connectors for long-lasting performance, delivering consistent connectivity and enhanced device reliability under demanding conditions.
Configuration | Pitch | Circuits | Current (Max.) | |
---|---|---|---|---|
Quad-Row Connectors | Board-to-board | 0.175mm | 20, 32, 36, 64 | 0.3A |
SlimStack Connectors | Board-to-board | 0.35 to 1.25mm | 6 to 240 | 18.0A |
Type | Circuits | Ejector Type | |
---|---|---|---|
Memory/SIM Card Connectors | SD, SIM Card, and Combo Sockets |
6 to 9 | Push-Push; Push-Pull; Hinge; Tray; Pin-Eject |
Power Management Connectors
As smart devices grow more powerful, effectively managing battery life and heat generation is essential for maintaining a seamless user experience. Advanced power connectors and thermal management solutions promote efficient energy use, reduced heat and longer device runtime. The Molex smart device portfolio includes miniaturized low-power connectors that minimize power loss during transmission and extend battery life.
Battery Pack Connectors
Configuration | Pitch | Circuits | Current (Max.) | |
---|---|---|---|---|
SlimStack GCB7X Battery Connectors | Board-to-board | 0.35 to 1.25mm | 6 to 240 | 18.0A |
FFC/FPC Connectors | Wire-to-board | 0.20 to 2.00mm | 2 to 120 | 2.0A |
Charging Connectors
Configuration | Current (Max.) | Voltage (Max.) | Durability (Min.) | |
---|---|---|---|---|
Micro-USB Connectors | Wire-to-board | 1.0A (signal), 1.8A (power) | 30V | 10,000 cycles |
USB Type-C Connectors | Wire-to-board | 6.0A | 48V | 10,000 cycles |