March 17, 2026
LISLE, IL – March 17, 2026 – Molex, a global electronics leader and connectivity innovator, today announced plans to demonstrate practical live data transfer using its next-generation XPO interconnect solution in both the Molex (#1749) and Arista (#1571) booths at OFC 2026, the world’s leading optical fiber cable conference, in Los Angeles this week.
Next-generation AI workloads are driving unprecedented requirements for bandwidth density, power delivery and signal integrity. Industry collaborations across major interconnect standards are required to ensure support for ever-increasing levels of performance and density in next-generation data centers. Through its innovative XPO BiPass solution, Molex is supporting leading AI architects and ecosystem partners as well as leading ASIC vendors, as they push the limits of performance, power, thermal delivery and density in next-generation data centers. Molex brings a proven history of leadership and collaboration across major interconnect standards, including longstanding support of the OSFP and DDQ (QSFPDD) MSAs, enabling scalable, high-speed connectivity in cloud and hyperscale data centers.
XPO is the next generation of pluggable architecture available after OSFP. High-density signal capability demonstrated in early XPO hardware includes 128 differential pairs and 224Gbps PAM-4 per differential pair while supporting increased power and passthrough capability over prior pluggable module generations.
Experience the Future of AI Connectivity at OFC 2026
Molex is committed to innovations of manufacturable, reliable interconnect solutions designed to support increasing data rates, tighter form factors, higher density and the system level challenges introduced by next-generation AI clusters across the interconnect industry. The company will showcase live data transfer, product module/connector closeups, engineering CAD renders and assembly shots in both the Molex booth (#1749) and Arista booth (#1571) at OFC. Molex will also showcase its complete optical stack and CPO solutions as well as present a live demonstration of its High‑Radix Optical Circuit Switch (OCS) Platform to highlight real‑time optical path reconfiguration and operational stability at scale.