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Open Compute Project: High-Performance Computing

Emerging cloud technology in data centers is a key factor driving the demand for new systems that offer disaggregated hardware and resilient, portable software. As part of our commitment to customer collaboration and next-generation data center technology, Molex is an active participant in the Open Compute Project (OCP), an industry organization dedicated to compatibility and scalability in high-performance computing (HPC). 

OCP Solutions at a Glance

Open Compute Project Key Principles

The Open Compute Project (OCP) fosters an ecosystem where global community members including hyperscalers, telecom providers, enterprise IT users and suppliers collaborate to innovate server and storage technologies. This initiative promotes the development and mainstream adoption of the most effective designs for scalable computing environments.

Key principles include the open sharing of ideas, specifications and intellectual property, which OCP asserts as crucial for maximizing innovation and reducing complexity in technology components. This ethos supports the development of commodity hardware that is not only more efficient but also flexible and scalable, challenging the traditional limitations imposed by proprietary, standardized equipment.

Molex actively contributes to the OCP community, focusing on next-generation data center technologies and customer collaboration, driven by the growing demands for disaggregated hardware solutions for the cloud.

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“Molex is a proud member and contributor to the OCP community, working alongside hyperscalers, telecom providers, enterprise IT users and other industry suppliers. We remain committed to providing innovative solutions for standardizing server architecture, enhancing system performance and efficiency, and enabling modularity.”
Keegan McGraw
Technologist, Data Center 
Molex

Open Compute Project Initiatives

DC-MHS Modular Server Hardware Solutions

Molex is driving innovation in data center technology with the Open Compute Project's DC-MHS initiative, which champions modular and scalable hardware solutions. Learn about our role as a recommended supplier, shaping the future of data centers to meet the dynamic demands of hyperscalers and advanced applications.

Discover DC-MHS Components

The Modular Forms of Open Accelerator Infrastructure

High-speed data centers encounter compatibility and scalability hurdles, which OCP aims to address with open accelerator modules (OAMs). Molex mezzanine connectors play a pivotal role in this innovative accelerator infrastructure. 

Elevate Performance Now

Advancing Open Compute Power Distribution

As server designs evolve to incorporate high-performance computing and artificial intelligence, the landscape of data center power distribution is undergoing a significant transformation. With escalating power needs driven by the expansion of IoT and edge computing, data centers must adapt with agile, decentralized power management strategies.

Explore Power Distribution

OCP Global Summit 2024: From Ideas to Impact

Interconnect Design Optimization and Predictive Reliability Models for Immersion Cooled Interconnects

Immersion cooling systems pose design challenges for interconnect solutions.   Nrupathunga Chakravarthy, Senior Technology Manager for Molex, dissects key design considerations and the need for testing in immersion. The study highlights potential failure modes, establishes a framework for long-term performance and explores how evaluating each design element helps improve reliability and cost performance.

PCIe Active Electrical Cables (AECs) Enabling Scale-Out Large Language Model LLM Computing Clusters

The move towards AECs using retimers for 112G and 224G PAM-4 ethernet applications has been driven by the desire to apply lower cost, copper-based solutions, while maintaining sufficient channel reach. Molex’s Chris Kapuscinski and Astera Labs’ Chris Petersen share their expertise in evaluating retimer technology for PCIe applications.

Next Gen PCIe Active and Passive Cable Solution for Enhanced Signal Integrity and Reach

Molex’s Eric Chu and Arthur Lai team up with Ashika Pandankeril Shaji and Brian Costello of TE Connectivity to explore the pivotal role of PCIe technology in AI and ML applications. The study focuses on optimizing near-chip interconnect designs, tackling challenges such as signal integrity issues from PAM-4 modulation, ground resonances and mechanical reliability

High Speed Board-to-Board Connector – The Road to 224Gbps, Presented by Molex

As the demand for faster and more efficient data transmission in electronic systems continues to grow to 224Gbps, the development of high-speed board-to-board connectors has become a crucial area of focus. Waikiong Poon, New Product Development Manager for Molex, explores the journey towards achieving an unprecedented data rate of 224Gbps in board-to-board connectors.

OCP Global Summit 2023: Scaling Innovation through Collaboration

AMD Mojanda Reference Design

AMD and Molex present the Mojanda FLW reference design developed by AMD using SP5 sockets that enable PCIe Gen5. Mojanda utilizes Molex NearStack PCIe (SFF TA1026) connectors.

 

 

High-power Interconnects for Single-Phase Immersion Cooling

Molex Principal Engineer Dennis Breen discusses the material compatibility of interconnects in a dielectric liquid. By understanding chemical, electrical, mechanical and environmental factors, material selection and the performance of interconnects can be improved. 
 

Thermal Characterization of High-Power Pluggable Optical Modules

In the leap to 224G data rates, enhanced processing power brings with it inherent thermal impacts, making thermal management both critical and challenging. Molex’s Hasan Ali and Cisco’s Joe Jacques highlight limitations of today’s case temperature approach and discuss alternate methodologies, weighing pros and cons from system and module designers’ points of view.

Enabling Copper for Next Generation Artificial Intelligence Computing

In a groundbreaking partnership between Molex and NVIDIA, this project aims to revolutionize the field of AI by leveraging the potential of copper-based technologies. Molex brings its expertise in developing high-speed board-to-board connectors, which deliver reliable and efficient data transmission within AI systems.
 

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