Skip to main content
With and Without Cap

Slim-Grid Connectors

Based on a 1.27 by 1.27mm-grid pattern, this high-current density board-to-board interconnect solution offers complete design flexibility and higher current density per inch to support variety of data, automotive, industrial and consumer board-to-board and cable-to-board applications.

Pitch  Current Circuits
1.27mm 4.3A (per circuit) 4 - 24

Features and Benefits


Customers from a variety of industry sectors are asking for a ‘future-proof’ interconnect solution that can support long life-cycles similar to the Milli-GridTM family but with the following requirements: smaller than 2.00mm-pitch size; preferably shrouded; include inter-locking and polarization features; preferably SMT but with options of through-hole variants; higher current density per inch than Milli-Grid connectors.

Building on a comprehensive list of potential customer requirements and soliciting further inputs from the field, Molex developed an array of board-to-board connector solutions to satisfy customer requirements including (but not limited to the following): 1.27mm-pitch (base on a 1.27 by 1.27mm-grid pattern); shrouded housing for maximum terminal protection; unshrouded variants available for greater design flexibility; robust locking mechanism that ensures mating reliability; choice of SMT and through-hole mounting; supports 4.3A per circuit.


Locking Windows/Ramp
Ensures robust connector retention when mated

Locating Pegs (Shrouded Right Angle Header, Through-hole)
Ensure precise connector positioning on PCB

Single-sided Polarization Slot
Prevents wrong orientation and mis-mating
Improves mating for smaller circuit sizes of 6 and below

Videos


Applications


Car audio
Navigation Systems

Portable electronic devices
Smartphones

Drones
Energy efficient appliances
Home theaters
White goods

Routers
Servers
Switches

This is not a definitive list of applications for this product. It represents some of the more common uses.