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NearStack Connector System

NearStack High-Speed Cable Assembly Solutions deliver superior performance with twinax wire advantages by implementing an optimized direct-to-cable connector system that that maximizes system performance.

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 Impedance   Pitch Wire AWG
85 and 100 Ohm 0.50 to 0.60mm 30 to 34 based on application

NearStack 100 High-Speed I/O Connectors

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NearStack 100 Ohm High-Speed I/O Cable Assemblies

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NearStack HD High-Speed I/O Connectors

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NearStack HD High-Speed I/O Cable Assemblies

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NearStack PCIe High-Speed I/O Connectors

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NearStack PCIe High-Speed I/O Cable Assemblies

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Features and Benefits

High-speed, high-density applications are avoiding traditional PCB materials for routing sensitive differential signals due to board congestion, high cost of PCB materials and variability in manufacturing. As system requirements and physical sizes expand, signal channels extend in length and become challenging to accomplish, while limited solutions exist in the standard PCB world. The NearStack product family is an innovative solution from Molex for these next-generation system challenges.

NearStack 100-Ohm Connectors

Designed as a small package and compatible with Molex BiPass I/O, NearStack 100-Ohm Connectors utilize 34 AWG Twinax cables to create a high-speed jumper product in 8- and 16-differential pair (DP) variants.
 
  • Targets applications with 100-Ohm impedance
  • Supports 34 AWG Twinax
  • In production
  • Built with modular wafer/bay structure
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NearStack PCIe Connectors

A cable solution designed specifically to support PCIe Gen-5 requirements, both from signal integrity (SI) and pin count perspectives, NearStack PCIe Connectors provide a dense, low-profile solution for interconnecting PCIe Gen-5 system components while delivering industry-leading SI performance.

  • Speed: PCIe Gen-5 (32 Gbps), roadmap to Gen-6
  • x8: 18 DPs (30 AWG) and 16 single-ended lines (34 AWG)
  • Right angle, angled, and vertical cable exit orientations
  • Metal shroud on plug and cable positive latch
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NearStack On-the-Substrate Connectors

Designed as a direct-to-chip solution, NearStack On-the-Substrate Connectors allow for “connector-ization” of the ASIC package by placing NearStack connectors directly on the chip substrate. High-speed signals from the chip avoid the PCB altogether, exiting through the 0.50mm SMT plug and low-profile cable assembly.

  • 56 Gbps PAM-4 / 112 Gbps PAM-4
  • Direct-to-chip substrate cabling with on-the-substrate connector
  • On-the-substrate PCB plug sits directly on substrate surface
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NearStack HD Connectors

The NearStack HD Connector System is a low-profile, high-density cable solution with a 64 Gbps PAM-4 data transfer rate that meets PCIe Gen-6 standards for internal cable applications and helps users support artificial intelligence (AI) and machine learning applications.

  • Data Rate: PCIe Gen-6 (64 Gbps PAM-4)
  • Impedance: 85 Ohms
  • Circuits: 56 (18 differential pairs)
  • Wire: 34 AWG Twinax
  • Cable Lengths: 110mm to 1.0m
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NearStack ExT Connectors

A unique application, ExT enables the “External Topology” for cable-to-cable interface at the chassis panel, utilizing NearStack direct-to-contact Twinax technology within a dense 20-DP port. A robust mechanical design enables a consistent, reliable external mating experience.

  • 56 Gbps PAM-4 / 112 Gbps PAM-4
  • Allows for internal-to-external system interface utilizing NearStack technology
  • No PCB needed to exit system
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Open Compute Project (OCP) Standard
NearStack PCIe has been included in the OCP Modular – Extensible I/O (M-XIO) base specification and the Modular– Full Width HPM Form Factor (M-FLW) as part of the next-generation OCP Data Center – Modular Hardware Systems (DC-MHS) family.

Unique Contact Interface
NearStack flexing beams are a feature of the NearStack cable receptacle to prevent pre-loaded beam relaxation through reflow and to avoid damaging hard-to-rework PCBs.
 Reduced stub lengths vs traditional cantilevers on the PCB pad.

Small Form Factor (SFF) Standard
NearStack PCIe has been defined and adopted by the SFF Committee as standard SFF-TA-1026 and ensures inter-vendor operability between Molex and other vendors while helping create a robust supply chain.

High pitch density and stackability
Available in two pitches, 0.60 and 0.50mm.
45° cable exit allows for minimum PCB area usage.
Density ranges between 30 to 50 DPs/sq. in. depending on the product family and number of DPs within a single connector.

Direct-to-Contact Weld Termination
Wires are welded directly to the signal contact
Removes paddle card from the assembly
Produces highly repeatable assemblies for predictable SI results

Datasheets and Guides

Applications by Industry

Battery farms
Factory equipment
Robotics

Switches

AI infrastructure
Data centers
Servers and machine learning
Storage devices

AI systems
Cell towers/remote radio unit applications
Core routers
Device control units
High-performance computing
Networking devices
Top-of-the-rack switches

This is not a definitive list of applications for this product. It represents some of the more common uses.

Frequently Asked Questions

What are the benefits of an on-the-substrate connector?
The NearStack On-The-Substrate Connector is designed as a direct-to-chip solution, which allows for “connector-ization” of the ASIC package by placing NearStack connectors directly on the chip substrate.

Does NearStack utilize direct-to-contact termination?
NearStack Connectors do utilize direct-to-contact termination by welding the Twinax directly to the signal terminals within the cable connector. This eliminates the need for a "paddle card" and manual soldering.

What are the benefits of angled-exit NearStack HD connectors?
NearStack HD is available with 90-degree (right-angle) and angled wire exit options. The advantage of the angled-exit connector is that it permits multiple NearStack HD connectors to be placed closer together in high-density, space-constrained applications. Right-angle NearStack HD connectors can be placed on 20.50mm centers, while NearStack HD angled-exit connectors can be placed on 16.00mm centers.