Engineering readers and analysts at leading China publications recognize Molex NearStack as “High Performance Passive/Discrete Device of the Year!” 

Molex, a global electronics leader and connectivity innovator, has been selected by ASPENCORE senior analysts and engineering user community as one of the winners of 2022 ASPENCORE World Electronics Achievement Awards (WEAA). The prestigious awards recognize products in several categories and Molex has won a top award in the High-Performance Passive/Discrete Devices of the Year category.

Competition for the 2022 Awards was intense with members of the judging panel working hard to determine the best products based on key criteria. Once the shortlists were announced voting was opened to the ASPENCORE engineering community, including readers of EETimes China, EDN China and ESMChina, to select the best products in China.

“At Molex we are pleased to see this innovative product line recognized by the analysts at ASPENCORE and the engineering community in China,” said Bill Wilson New Product Development Manager at Molex. "High-speed, high-density applications are avoiding traditional PCB materials to route sensitive differential signals due to board congestion, expensive cost of PCB materials and variability in manufacturing. As system requirements and physical sizes expand, signal channels extend in length and become challenging to accomplish; limited solutions exist in the standard PCB world. We are delighted that the NearStack product family, an innovative solution for these next-generation system challenges, has been recognized by the engineering community in China."

NearStack PCIe Connector Systems and Cable Jumper Assemblies create a direct connection from anywhere in the system to near the ASIC, using twinax cables to deliver a PCB alternative while improving signal integrity, lowering insertion loss and reducing signal latency. Being optimized for height they come with a low profile mated height of 11.10mm (R/A cable) to reduce airflow interference and allow for placement in tighter spaces within the system alternative.

• NearStack 100 Ohm: Designed as a small package and compatible with Molex BiPass I/O, NearStack 100 Ohm utilizes 34 AWG twinax cable to create a high-speed jumper product for our customers in 8DP and 16DP sizes.
• NearStack PCIe: A cable solution designed specifically to support PCIe Gen 5 requirements, both from a signal integrity and a pin count perspective, NearStack PCIe provides a dense, low-profile solution for interconnecting our customers’ Gen 5 PCIe system components with leading SI performance.
• NearStack On-the-Substrate: Designed as a direct-to-chip solution, NearStack On-the-Substrate allows for “connector-ization” of the ASIC package by placing NearStack connectors directly on the chip substrate. High-speed signals from the chip avoid the PCB altogether, exiting through the 0.50mm SMT plug and low-profile cable assembly.
• NearStack ExT: A unique application, ExT enables the “External Topology” for cable-to-cable interface at the chassis panel, utilizing NearStack direct-to-contact twinax technology within a dense 20DP port; a robust mechanical design enables a consistent, reliable external mating experience.

World Electronics Achievement Awards
The World Electronics Achievement Awards (WEAA) honor companies and individuals who have made outstanding contributions to the innovation and the development of electronics industry worldwide. 
Winners were elected by a committee comprised of Aspencore global senior industry analysts as well as online users from Asia, the US and Europe.