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Connectors

Automotive Micro Board-to-Board Connections

Joining Automotive with Consumer Experience and Reliable Power Connectivity
With decades of experience in the automotive industry and over 15 years of providing mobile and ruggedized micro-interconnects for consumer devices, Molex leverages its combined knowledge to design and develop advanced FPC-to-board and board-to-board connectors to deliver the high-power connectivity needed in ADAS/AD, hybrid vehicle and EV applications.

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Products

Flexi-Latch+ Connectors

The demand for additional signal connections in EVs means more connectors that will potentially increase the weight of vehicles. Automotive engineers must maximize their design space as they keep the overall weight of the system in mind. Flexi-Latch+ Connectors provide reliable and robust connector solutions affording compact and lightweight designs, especially suited for EV battery systems.

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ZN Stack High-Speed Floating Board-to-Board Connectors

ZN Stack high-speed, high-current floating connectors revolutionize vehicle electronics design by meeting increasing demands for data processing, power distribution and system reliability. These automotive-validated connectors offer both right-angle and vertical/stacking versions for design flexibility and support up to 32Gbps data rates within a compact footprint. Delivering reliable, high-performance connectivity in harsh automotive environments, ZN Stack Connectors provide cutting-edge solutions for automotive applications, including zonal architecture, advanced driver assistance systems (ADAS) and high-speed computing.

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High-Speed 0.50mm-Pitch Floating Board-to-Board Connector for ADASs

Autonomous Driving Will Never Be the Same
As automakers race to meet the accelerating demand for advanced driver assistance systems (ADASs)/autonomous driving (AD) capabilities, a growing number of electronic control units (ECUs) and next-generation domain control units (DCUs) are being added to vehicles. As a result, suppliers need a source for micro-interconnect solutions that perform reliably, even in the harshest environments.

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A footprint of 215.30mm²:
• Delivers one of the smallest footprints in the market
• Mitigates space constraints on PCBs

Up to 32 Gbps data rate:
• Provides faster data speeds than PCIe 4
• Offers low latency performance

Mating Guide:
Makes mating easier and potentially lowers the risk of mis-mating

Full terminal covers:
Keeps dirt and debris away from terminals to ensure reliable connectivity

Stack height from 16.00 to 32.00mm and from 60 to 200 circuits:
Delivers design flexibility

Wide floating range:
• Offers ±0.60mm float in the x axis, ±0.80mm in the y axis and ±0.80mm in the z axis
• Facilitates automated assembly