Part Number	Web Description	Sample Eligible	Breakaway	Circuits (Loaded)	Circuits (maximum)	Color - Resin	Durability (mating cycles max)	First Mate / Last Break	Flammability	Glow-Wire Capable	Guide to Mating Part	Keying to Mating Part	Lock to Mating Part	Mated Height	Material - Metal	Material - Plating Mating	Material - Plating Termination	Material - Resin	Net Weight	Number of Rows	Orientation	Packaging Type	PCB Locator	PCB Retention	Pitch - Mating Interface	Plating min - Mating	Polarized to Mating Part	Polarized to PCB	Shrouded	Stackable	Temperature Range - Operating	Termination Interface Style
2028280068	Mirror Mezz Hermaphroditic Connector, 2.50mm Connector Height, BGA-Attach Mounting, 15 Pair, 11 Row, 688 Circuits, 0.76µm Gold (Au) Plating, without Pegs	No	No	688	688	Black	100	No	94V-0	No	Yes	No	No	5.00mm	High Performance Alloy (HPA)	Gold	Tin	High Temperature Thermoplastic	5.360/g	11	Vertical	Embossed Tape on Reel	Yes	Yes	1.50mm, 4.00mm	0.762µm	Yes	Yes			-55° to +105°C	BGA Solder
2028280506	Mirror Mezz Hermaphroditic Connector, 2.50mm Connector Height, BGA-Attach Mounting, 6 Pair, 5 Row, 124 Circuits, 0.76µm Gold (Au) Plating, with Pegs	Check Availability	No	124	124	Black	100	No	94V-0	No	Yes	No	No	5.00mm	High Performance Alloy (HPA)	Gold	Tin	High Temperature Thermoplastic	1.455/g	5	Vertical	Embossed Tape on Reel	Yes	Yes	1.50mm, 4.00mm	0.762µm	Yes	Yes	Yes	Yes	-55° to +105°C	BGA Solder
2028281506	Mirror Mezz Hermaphroditic Connector, 2.50mm Connector Height, BGA-Attach Mounting, 6 Pair, 15 Row, 404 Circuits, 0.76µm Gold (Au) Plating, with Pegs	Check Availability	No	404	404	Black	100	No	94V-0	No	Yes	No	No	5.00mm	High Performance Alloy (HPA)	Gold	Tin	High Temperature Thermoplastic	3.330/g	15	Vertical	Embossed Tape on Reel	Yes	Yes	1.50mm, 4.00mm	0.762µm	Yes	Yes	Yes	Yes	-55° to +105°C	BGA Solder