| Circuits | Data Rate | Current | Protocols |
|---|---|---|---|
| 6, 12, 14, hybrid | Up to 13.5Gbps | 1.5A | A2B, DisplayPort, USB 1.0 to 3.0 Gen I, GMSL 1 to 3, FPD-Link I to IV, Ethernet, APIX 2/3 |
Features and Benefits
Automotive manufacturers are challenged with incorporating an increasing number of high-performance devices into vehicle architectures. These devices require real-time, secure and dependable connectivity to vehicle networks using solutions that can accommodate a variety of specific protocols and application needs. Connectivity solutions must also help simplify system designs, while saving space and reducing weight.
By using rugged, miniaturized, automotive-grade connectors, designers can achieve reliable connections that fit increased functionality into limited space. Versatile interconnect solutions can accommodate multiple devices and protocols using the same interface, simplifying sourcing and improving efficiency.
The HSAutoLink II Interconnect System supports multiple high-speed protocols within the same connector, including USB 3.0, LVDS and Ethernet. Multiple high-speed pin configurations and cable exit options optimize PCB space and simplify design work. The proven low-force helix (LFH) terminal, fully protected shield case and robust sealing options rated up to IP69K help ensure reliable high-speed data transfer performance even in challenging automotive conditions. A variety of off-the-shelf and customizable cable assemblies, together with global manufacturing and engineering support from Molex, enhance design flexibility and help accelerate deployment.
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Applications by Industry
Diagnostics
Instrument systems
Telematic devices
ADAS
Automotive Miniaturization
Center Stack System
In-Cabin Applications
Zonal Architecture
Cameras
Camera-to-controller/controller-to-display
Diagnostics
Heads-Up Display
Instrument systems
Telematic devices
Navigation
Commercial & Industrial Vehicles
All-Terrain vehicles
Commerical trucks
Data storage and transfer devices
Motorcycles
Watercraft
This is not a definitive list of applications for this product. It represents some of the more common uses.
Frequently Asked Questions
What is the HSAutoLink II Interconnect System?
The HSAutoLink II System is a high-speed differential-pair connectivity solution designed for automotive and commercial vehicle applications, supporting data rates up to 13.5Gbps and multiple protocols such as USB, LVDS, and Ethernet. It features robust and flexible connector designs, including sealed and unsealed options, ensuring reliable performance even in harsh environments while offering versatility and adaptability to evolving automotive technologies.
For what applications is the HSAutoLink II Interconnect System intended?
The HSAutoLink II System is ideal for automotive applications such as infotainment systems, digital displays including clusters, head-up displays (HUDs), front and rear displays, engine control modules (ECUs), vehicle control modules (VCUs), USB devices, advanced driver assistance systems (ADAS) and cameras. It is also useful in agricultural and industrial equipment, including semi-trailer trucks, construction machinery, ATVs, watercraft and motorcycles.
How does the HSAutoLink II System ensure robust connections?
HSAutoLink II connectors have sealed options rated at IP67 and IP69K for wet conditions. The CPA push area ensures easy installation, while the positive-lock mechanism guarantees reliable connectivity in high-shock or high-vibration applications. The 360-degree shielded core enhances electromagnetic interference (EMI) resistance.
What are the validation standards for the HSAutoLink II System?
The HSAutoLink II System complies with validation standards like GMW3191 and USCAR and can also be validated to meet specific customer requirements.
How does the HSAutoLink II design save space on the PCB?
The HSAutoLink II header optimizes PCB space by combining multiple protocols into a single connector, eliminating the need for multiple connectors. This streamlined design minimizes the overall footprint. Custom solutions are tailored to meet specific customer requirements and applications.
What terminal design is used?
The HSAutoLink II System uses soldering technology with a low-force helix (LFH) terminal that delivers proven reliability and high-speed signaling performance.
What configurations are available for HSAutoLink II connectors?
- Unsealed and sealed
- Wire-to-wire and wire-to-board
- Surface-mount technology (SMT) and plated through-hole (PTH) headers
- Single, dual and triple exits
What are the advantages of the LFH terminal?
- Low insertion force due to gradual separation of receptacle contacts (0.5N per circuit)
- High durability, withstanding up to 5,000 mating cycles with a standard gold plating finish
- Two contact beams to provide multiple current paths, minimal path length, and low and stable contact resistance
- Contact geometry and high density promote high signal bandwidth in differential signaling environments
- Continuous current-carrying capacity of 1.5A
What keying options are available for HSAutoLink II housings?
Connector housings are available in up to six different keying options, each with a unique color for easy identification. These keying options help ensure proper mating and prevent misalignment during assembly.
