Automotive mega trends, such as electrification, autonomous driving and safety features, as well as high-speed and wireless connectivity, are not only persisting, but becoming more widespread. Published in January 2021, a Molex survey of 230 qualified decisionmakers at automotive OEMs revealed that 91% believed the “car of the future” will be fully electric or hybrid. Additionally, 94% think it will include autonomous driving features and that high-speed Wi-Fi and wireless charging will be its most popular features. In fact, safety and driver empowering systems, such as larger displays, camera systems and detection sensors like LIDAR, are increasing on nearly all models. These trends are also encouraging engineers to increase the capabilities of these features while powering them with denser and smaller components.
To aid in this rapid expansion of new and evolving electronic systems, designers are driven to miniaturize and, as a result, seek out new components and interconnect technologies. Often, designers have turned to components and interconnects that are common to mobile and consumer electronics. However, while micro components alleviate space constraints in a car designs, they also will need to prove reliability in these rugged applications. Also, in order to meet their customers’ expectations, automotive OEMs and their suppliers require a certain level of electronic component excellence, including wide temperature ratings, shock and vibration validation, along with adherence to Automotive Production Part Approval Process (PPAP).