BiPass Cable Technology

Implementing high data rates such as 224, 112 and 56G PAM-4 requires a low-loss, low-crosstalk and clean channel to maintain signal integrity and performance. BiPass Cable solutions offer a significant advantage over traditional PCB materials by dramatically reducing insertion loss between the Application-Specific Integrated Circuit (ASIC) and the front panel I/O, resulting in greater channel margins and improved overall system reliability. 
 
As ASICs continue to scale in performance and power consumption, maintaining signal integrity across traditional PCB traces becomes increasingly difficult. To meet these challenges, data center and network designers are forced to adopt costly premium PCB materials to preserve signal quality and channel reach. BiPass Cable Technology provides a cost-effective and high-performance alternative by using Twinax cables to create a high-speed and more reliable signal path. 
 
ASICs consume more energy and operate at higher frequencies, which limits their ability to provide the same channel reach as previous generations. Even with retimers in external cables and optical transceivers, ASICs may still struggle to reliably reach the front of the I/O. BiPass Cable Technology offers a promising solution by potentially eliminating the need for retimers, which helps reduce overall thermal power consumption and improve system efficiency.

Meet the demands of next-generation data centers and networking infrastructure with our 224G BiPass solutions. These solutions are engineered to support data rates up to 224Gbps for high-speed, low-latency connectivity and efficient signal routing. Ideal for AI, machine learning and cloud-scale computing systems, 224G BiPass solutions are built for flexibility, scalability and optimized performance in high-density environments. 
 
One major challenge in achieving 224G data rates is signal integrity. Traditional PCB materials introduce significant insertion loss, limiting channel reach and system reliability. Molex addresses this with its hybrid-unicore Twinax cable technology, which significantly reduces insertion loss and improves channel margins for superior signal integrity. 
 
Another key challenge is power and thermal management. As ASIC speeds increase, so does power consumption and heat generation. Molex’s BiPass Solutions eliminate the need for power-consuming retimers, reducing thermal load and improving overall energy efficiency. As board space becomes more constrained, flexible component placement is essential. Molex offers near-ASIC connectivity with a wide range of connector options and customizable configurations, helping designers optimize layout and maximize port density. Their scalability and system efficiency supports growing system complexity without compromising thermal performance.

As data centers and telecom infrastructure evolve, 112Gbps PAM-4 signaling has become the standard for high-speed serial data transmission. Meeting the demands of this protocol requires clean signal channels with low signal-to-noise ratios and minimal signal degradation. BiPass I/O Cable Assemblies offer a powerful solution by enabling designers to bypass traditional PCB materials and instead use high-speed Twinax cabling for direct signal routing. 
 
One of the primary challenges in implementing PAM-4 signaling is managing insertion loss, which can significantly impact signal quality and channel reach. BiPass I/O Cable Assemblies significantly reduce insertion loss between the ASIC and front panel I/O, creating greater channel margins. 
 
Another challenge is maintaining signal integrity in increasingly dense and power-demanding systems. The BiPass solutions support efficient thermal management and clean, low-loss channels, which is crucial for high-performance 112Gbps systems. With the increasing cost and complexity of PCBs, BiPass solutions offer a flexible, cost-effective alternative that improves system design while supporting the latest protocol standards.

The key challenge in 56G system design is managing insertion loss across the channel. Traditional PCB materials introduce significant loss, limiting data rate and reach. BiPass assemblies address this issue with Twinax cabling that significantly reduces insertion loss and enhances channel margins. BiPass 56G assemblies are engineered to support high-speed data transmission with exceptional signal integrity and minimal insertion loss. 
 
Another challenge is maintaining signal integrity in dense system architectures. The superior electrical performance of BiPass ensures cleaner signals and better eye diagrams at high data rates. The compact and efficient design of BiPass assemblies by employing high-speed Twinax cabling bypass the lossy printed circuit board (PCB). This significantly helps reduce insertion loss between the ASIC and the front panel I/O and optimize board layout making them an ideal solution for scalable, high-performance applications. 

This is not a definitive list of applications for this product. It represents some of the more common uses.