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AI Switch Tray Connectors

High-speed AI switch trays must preserve signal integrity across dense ASIC-to-I/O and system-level links as traditional board-routed copper approaches its practical limits, while managing high power demands within increasingly tight thermal envelopes. High-performance interconnect solutions deliver reliable data and power transmission despite the stringent electrical, mechanical and thermal constraints of AI switch tray applications. Molex provides an extensive portfolio of copper, optical and power connections engineered to support high-speed data rates, while offering the space-efficient integration and design flexibility needed to scale AI networks.

Designing High-Performance Connectivity for AI Switch Trays

As AI switch tray data rates increase, PCB trace loss becomes increasingly difficult to manage, creating challenges in supporting high-bandwidth ASIC-to-I/O connectivity while balancing routing density, thermal constraints and ease of maintenance. Integrating AI switch trays into larger systems requires high-bandwidth switch-to-switch connectivity over distances that can exceed the practical reach of electrical copper links. Accommodating numerous ports within constrained front-panel and backplane space complicates connector integration and signal routing, while rising tray power makes thermal and power-delivery decisions vital to the connectivity design.

Near-package and co-packaged copper (NPC and CPC) architectures bring high-speed connectivity closer to or onto the ASIC package, reducing dependence on long PCB traces and extending high-speed electrical reach. Co-packaged optics (CPO) architectures integrate optical interfaces at or near the ASIC package, supporting switch-to-switch data paths well beyond copper's limit. The appropriate interconnect topology facilitates a cohesive design across the tray, from front-panel and backplane I/O to power distribution, helping preserve signal performance while streamlining routing, cooling and assembly.

Molex supports high-speed connectivity across the switch tray with solutions for NPC, CPC and CPO architectures that help preserve signal integrity and support greater bandwidth density. Space-efficient solutions for system I/O, backplane ports and power delivery support a cohesive tray design that addresses the application’s mechanical and thermal requirements while retaining serviceability.

High-bandwidth ASIC-to-I/O links in modern switch trays face limited electrical reach, routing congestion and thermal-management demands. Selecting the appropriate connectivity approach, whether NPC, CPC or CPO, enables engineers to shorten high‑speed electrical paths while balancing signal integrity, bandwidth density, thermal performance and serviceability. Molex provides copper and optical solutions for these ASIC‑adjacent architectures so designers can match the interconnect strategy to system design priorities.

Near-Packaged Copper (NPC)

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Near-Packaged Copper AI Switch Tray Architecture

Co-Packaged Copper (CPC)

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Co-Packaged Copper AI Switch Tray Architecture

Co-Packaged Optics (CPO)

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Co-Packaged Optics AI Switch Tray Architecture

Near-ASIC Connectivity: Near-Package Copper (NPC)

AI switch trays face more pronounced signal loss at high data rates, driving the need to shorten PCB traces while maintaining the serviceability of a conventional board. NPC connectivity helps preserve signal integrity in dense architectures while enabling direct routing from the ASIC region to front‑panel or system interfaces. Molex BiPass Cable Technology with a near-ASIC connector, such as the CX2-DS connector, enables engineers to route high-speed signals over low-loss twinax, increasing channel margin while supporting a range of connector options.

  Configuration Data Rate Current Differential Pairs Wire Gauge Durability
CX2 Connectors and Cable Assemblies High-speed internal I/O Up to 112Gbps 0.5A per mated contact 32 31 AWG 200 mating cycles
CX2-DS High-Speed Connectors and Cable Assemblies High-speed internal I/O Up to 224Gbps 0.5A per mated contact 32 to 64 30 AWG 50 mating cycles
MicroBeam Connectors and Cable Assemblies High-speed internal I/O Up to 112Gbps 0.75A per pin 12 or 16 31 AWG 100 mating cycles
  Configuration Data Rate Aggregate Speed Interface/Cable Options Form Factor/Connectivity
BiPass Cable Technology High-speed pluggable I/O 56, 112 and 224Gbps PAM-4   Passive high-speed twinax OSFP, QSFP-DD, QSFP, CDFP or OSFP-XD to near-ASIC
OSFP Connector System High-speed pluggable I/O 56, 112 and 224Gbps PAM-4 Up to 1.6Tbps DAC, AEC, ACC, AOC OSFP; 8 or 16 lanes
QSFP-DD Connector System High-speed pluggable I/O 28Gbps NRZ; 56 and 112Gbps PAM-4 Up to 800Gbps DAC, AEC, optical QSFP-DD; 8 lanes

On-ASIC Connectivity: Co-Packaged Copper (CPC)

At 224Gbps PAM-4, combined insertion loss through the ASIC package and motherboard can erode channel margin, driving some designs to shorten the electrical path beyond NPC architectures. CPC moves the connection onto the ASIC package substrate to bypass long motherboard PCB traces, minimizing signal loss while introducing mechanical and serviceability considerations such as substrate protection and connector reworkability. Molex combines the Impress Co-Packaged Copper Solution with the XPO connector-and-cage assembly and BiPass twinax cabling to deliver a low-loss CPC path that supports 224G PAM-4 channels while maintaining connection density and serviceability.

  Configuration Data Rate Current Differential Pairs Wire Gauge
Impress Co-Packaged Copper (CPC) Solution High-speed internal I/O 224Gbps PAM-4 and beyond 0.5A per pair 32 or 64 30 AWG twinax; 32 AWG in development
  Configuration Data Rate Aggregate Speed Interface/Cable Options Form Factor/Connectivity
BiPass Cable Technology High-speed pluggable I/O 56, 112 and 224Gbps PAM-4   Passive high-speed twinax OSFP, QSFP-DD, QSFP, CDFP or OSFP-XD to near-ASIC
OSFP Connector System High-speed pluggable I/O 56, 112 and 224Gbps PAM-4 Up to 1.6Tbps DAC, AEC, ACC, AOC OSFP; 8 or 16 lanes
QSFP-DD Connector System High-speed pluggable I/O 28Gbps NRZ; 56 and 112Gbps PAM-4 Up to 800Gbps DAC, AEC, optical QSFP-DD; 8 lanes
XPO Connector Assemblies High-speed pluggable I/O 224Gbps PAM-4 Up to 12.8Tbps per module BiPass flyover; 32 AWG twinax XPO; 64 lanes (128 differential pairs)

On-ASIC Connectivity: Co-Packaged Optics (CPO)

As AI switch fabrics scale across larger systems, longer switch-to-switch distances can exceed the practical reach of copper interconnects, shifting longer-reach connections toward optical architectures. CPO supports these architectures by integrating optical connectivity at or near the ASIC package, extending reach and enabling scalable, high-density fiber-to-chip connectivity and optical routing. Molex TeraVERSE Detachable Optical Chiplet Connectors provide a self-aligning, detachable fiber-to-chip interface for CPO architectures that supports post-reflow attachment while improving repair and replacement.

  Configuration Fiber Type Fiber Count per Port Validations Cable Type
ELSFP Interconnect System External laser source connectivity Polarization-maintaining (PM) or singlemode (SM) Up to 12 (MT ferrule) OIF, RoHS, REACH, GR-468, GR-1435, TIA-604-5, IEC-61754-7-1 Bare fiber or round cable
  Configuration Fiber Type Optical Coupling Density Serviceability
TeraLIGHT Detachable Silicon Photonics Connectors Fiber-to-chip connectivity SM and PM Surface coupling to an expanded, collimated beam from the PIC Up to 50 fibers at 127µm pitch; several photonic plugs can connect to a single PIC using a modular socket design Post-reflow fiber connectivity through a serviceable, detachable photonic plug
TeraVERSE Detachable Optical Chiplet Connectors Fiber-to-chip connectivity SM and PM Surface coupling to photonic integrated circuits (PICs) using inverse-tapered waveguides (wideband) or grating couplers (narrowband) Up to 50 fibers at 127µm pitch per photonic plug; several photonic plugs can connect to a single PIC using a modular socket design Post-reflow fiber connectivity through a serviceable, detachable photonic plug
  Configuration Mode Routing Connector Type
FlexPlane Optical Circuitry and Routed Ribbon Cable Solutions Internal optical routing SM, multimode (MM), hybrid Custom/application dependent MTP, HBMT , MXC, LC, SC
  Configuration Interface/Ferrule Type Fiber Count Fiber Type Operating Temperatures
VersaBeam EBO Expanded Beam Connectors and Cables Blind-mate optical connectivity Expanded Beam 12, 16 or 144 fibers SM or MM -10 to +60°C
Versatile Format Interconnect (VFI) Optical Backplane System Blind-mate optical connectivity MT or VersaBeam MT 8, 12, 24 or 36 fibers per ferrule SM or MM -20 to +70°C
  Configuration Insertion Loss (max.) Return Loss (max.) Cable Outside Diameter Cable Length Fiber Count
MMC Cable Assemblies and Adapters Optical solutions 0.35 dB -55 dB 2.00 to 2.50mm 1.0 to 20.0m standard; up to 100.0m custom 16 or 24 fibers
MPO Cable Assemblies and Adapters Optical solutions 0.75 dB (SM); 0.35 dB (MM) -55 dB (SM); -25 dB (MM) 3.00mm 1.0 to 20.0m jumpers; longer custom lengths available 8, 12, 16, 24, 32 or 48 fibers; 72, 144 or 288 fibers in trunk cables

Network & System I/O Connectivity Solutions

Network and system I/O connections must accommodate high-speed data paths alongside management and service interfaces, creating challenges for connector integration and signal routing within constrained front-panel and backplane space. Copper and optical connectivity solutions provide options for balancing bandwidth, reach and packaging requirements while preserving signal integrity and simplifying mechanical integration. The Inception Backplane Connector and Cable System delivers dense connectivity at the rear of the tray, extending the high-speed signal path beyond the switch. Molex Modular Jacks and USB Type-A Connectors offer standardized, accessible front-panel interfaces for system management and service access.

Front-Panel Connectivity

  Configuration Data Rate (per Lane) Aggregate Speed External Cable Type Form Factor
OSFP Connector System High-speed pluggable I/O 56, 112 and 224Gbps PAM-4 Up to 1.6Tbps DAC, AOC, ACC/AEC OSFP
QSFP-DD Connector System High-speed pluggable I/O 28Gbps NRZ; 56 and 112Gbps PAM-4 Up to 800Gbps DAC, AEC, optical QSFP-DD
  Configuration Data Rate (per Lane) Aggregate Speed Reach Cable Type Form Factor
Active Electrical Cable (AEC) Solutions High-speed cable assemblies 112 and 224Gbps PAM-4 Up to 1.6Tbps Up to 7.0m, configuration dependent Retimed copper OSFP, QSFP-DD and QSFP
Active Optical Cables (AOCs) High-speed cable assemblies 1.0 to 14.0Gbps Up to 56.0Gbps Up to 300.0m standard; up to 4.0km custom Singlemode optical fiber QSFP+, iPass+ HD and CXP
Direct Attach Cable (DAC) Assemblies High-speed cable assemblies 28, 56, 112 and 224Gbps PAM-4 Up to 1.6Tbps Short-reach Passive twinax OSFP, QSFP-DD, QSFP, SFP-DD and zSFP
  Configuration Current Mating Cycles Data Transfer Speed USB Standard Voltage
Modular Jacks Management and service I/O Up to 1.5A Up to 2,500 Configuration dependent   150V AC (RMS)
USB Type-A Connectors Management and service I/O 1.0 to 1.8A 1,500 to 20,000 480Mbps to 5Gbps USB 2.0 and USB 3.0 Series dependent

Cold Plate Liquid Cooling for Data Centers

As front-panel I/O density and power increase in AI switch trays, managing heat at the front of the system becomes more challenging. Liquid cooling positioned behind the I/O cage helps remove heat from near high-speed interfaces while reducing reliance on air cooling alone. Molex cold plate liquid cooling solutions integrate cold plates, manifolds and sensing technologies to support dense, high-performance switch architectures.

Explore Liquid Cooling Solutions

Back-Panel and Backplane Connectivity

  Configuration Data Rate Differential Pairs Density/Spacing Interconnect Types Impedance
Impulse Backplane Connectors Backplane interconnect system 56Gbps NRZ; 112Gbps PAM-4 Up to 128 101 differential pairs per square inch; 4.00mm pair-to-pair and 2.00mm column-to-column spacing Conventional backplane, orthogonal direct, cable and hybrid 90 Ohms
Inception Backplane Connector and Cable System Backplane interconnect system Up to 224Gbps 3 to 13 Board mounted: 14.50 to 45.50mm mated height; cable: 29.20mm mated width Traditional, coplanar, orthogonal direct, mezzanine and cable 92 Ohms

Power Distribution and System Management Connectivity Solutions

As AI switch tray power demands continue to grow, power architectures are challenged to distribute higher current with minimal loss and heat generation while accommodating telemetry, management and expanded cooling infrastructure within the constrained tray footprint. Efficient power connectivity solutions that provide a complete power-delivery path from tray-level power entry to module-level distribution help reduce thermal loading, supporting efficient system integration and simplifying maintenance. For primary power entry, the Molex PowerPlane IT Gear Cable Assembly provides a busbar-to-cable connection between the rack busbar and the switch tray. At the module level, Molex Micro-Fit+ OCP M-PIC 12V Connectors integrate power and signal contacts within a compact form factor to support higher-power module connections.

Internal Power Distribution

  Configuration Current Voltage Contact Diameter Wire Gauge Operating Temperatures
PowerWize Connectors High-current wire-to-board and wire-to-busbar Up to 190.0A Up to 1,000V 3.40, 6.00 and 8.00mm 10 to 1/0 AWG -40 to +125°C
UltraWize High-Current Connectors and Cables Assemblies High-current wire-to-board Up to 170.0A 125V 8.00mm   -40 to +125°C
  Configuration Pitch Circuits Current Voltage Operating Temperatures
EXTreme Guardian System High-current power connectors 5.15, 5.78 and 11.00mm 2 to 70 Up to 80.0A Up to 600V -40 to +105°C; Guardian HD power circuits up to +125°C
EXTreme Ten60 High-Power Connectors High-current power connectors 2.00 to 7.50mm 1 to 72 Up to 94.0A Up to 600V, configuration dependent -40 to +105°C

Auxiliary and Module Power

  Configuration Pitch Circuits Power/Signal Configuration Current First-Mate/Last-Break
Mega-Fit Connectors Wire-to-board 5.70mm 2 to 12 Power Up to 30.0A No
Micro-Fit+ OCP M-PIC 12V Connectors Hybrid power and signal 3.00mm power/1.50mm signal 12 or 24 6 power/6 signal or 12 power/12 signal 13.5A power/1.0A signal Yes
Micro-Fit+ PCIe Connectors Hybrid power and signal 3.00mm power/2.00mm signal 16 12 power/4 signal Up to 9.5A per power contact Yes

Monitoring and Control Connectivity

  Configuration Pitch Current Voltage Circuits
CLIK-Mate Connectors Wire-to-board 1.25, 1.50 and 2.00mm 2.5 to 4.0A 50 to 250V 2 to 34
Micro-Lock Plus Connectors Wire-to-board 1.25, 1.50 and 2.00mm Up to 4.7A Up to 250V 2 to 42
Nano-Fit Connectors Wire-to-board 2.50mm Up to 8.0A Up to 250V 2 to 16
Pico-Clasp Connectors Wire-to-board 1.00mm Up to 2.0A 100V 2 to 50
Pico-Lock Connectors Wire-to-board 1.00, 1.50, 2.00 and 3.00m Up to 10.0A 150 to 250V 2 to 12

Rear of Tray and Power Shelf Interface

  Configuration Current Voltage Termination Styles Operating Temperatures
PowerPlane Busbar Connectors Busbar connectors 130.0 to 320.0A Up to 600V AC Solder tail, screw mount -40 to +125°C
  Configuration Application Current Voltage Plating Operating Temperatures
PowerPlane IT Gear Cable Assembly High-current cable assemblies IT gear power input from OCP ORV3 busbar Up to 500.00A Up to 52V Silver +15 to +70°C