Board-to-Board Connectors

High-density, solderless AirBorn Z Series compression connectors use a patented one-piece contact system and rigid guide pins to simplify installation, reduce costs, enhance reliability and enable flex circuit stacking for harsh aerospace, defense, space and industrial environments.

AirBorn RC Series connectors deliver high-density, stackable solutions that reduce connector counts and overall board stack height by up to 50% compared with traditional layouts. Robust, press-fit “eye-of-the-needle” contacts, versatile board spacing options, and repairable designs improve reliability and system uptime.

Fine-pitch battery connectors that provide up to 10.0A, a hybrid interface, wide alignment guides for easier mating and a robust metal armor cover that acts as housing protection for secure electrical and mechanical contact.

World’s smallest board-to-board connector ideally suited for space-constrained smartphones, smartwatches, wearables, AR/VR devices and more!

These compact connectors save PCB space while delivering excellent signal integrity (SI) performance for high-speed RF applications. Both the 15 GHz 5G15 Series and 25 GHz 5G25 Series offer high reliability, withstand shocks and vibration, and improve design flexibility in compact mobile, IoT, AR/VR and medical devices.

The C-Grid family of connectors offers benefits for a wide range of electronic products across industries. The latest version from Molex, C-Grid III, offers high mechanical stability in a compact 2.54mm pitch post and receptacle. Find the flexible C-Grid and C-Grid III components that fit your project.

KK connector systems are customizable for a variety of power and signal applications. Available in industry-standard 2.54, 3.96 and 5.08mm pitch sizes, this single-row, wire-to-board and board-to-board product family is cost effective and versatile.

Offers premium housing features to prevent mis-mating, reduce terminal backout, reduce operator fatigue during assembly and aid in blind-mating applications.

The Mini-Fit Connector family offers high-current, high-density power connectors that enhance design flexibility by providing a broad range of positive-locking and self-aligning solutions. Versions offering blind-mate capability, terminal position assurance and broad interoperability help improve reliability and reduce design complexity.

EXTreme Power products offer high-current interconnect solutions with best in class power densities. The extensive product offering ranges from EXTreme LPH 30.0A blades to EXTreme PowerMass 150.0A modules. Molex EXTreme Power products – made for your high-current applications.

The high-power Sentrality pin-and-socket system supports very high current ratings by providing reliable, durable and safe power connections. Self-alignment and other design features help streamline assembly and ensure safe, secure connections while minimizing the risk of accidental disconnection or electrical faults.

Compact hermaphroditic connectors in the Mirror Mezz family reduce application costs, eliminate the need for separate mating parts and maximize design flexibility by allowing designers to pair different connector height versions to achieve the desired stack height. These connectors support data speeds up to 224Gbps per differential pair for telecommunications, networking and other applications.

High-speed and low-profile SEARAY and SEARAY Slim mezzanine connectors deliver data rates over 12.5Gbps in a small footprint, supporting high-density signal transfer for networking and telecom applications. The narrow body design with multiple stack-height and circuit options helps optimize airflow and thermal management while ensuring reliable performance.

Using a mirror-image triad wafer design to optimize signal integrity, NeoScale mezzanine connectors deliver speeds up to 56Gbps in an ultra-high-density layout with 82 differential pairs per square inch. Robust design features enhance reliability while various stack heights and power-contact options enable customized solutions.

The SpeedMezz family, including SpeedStack and SpeedEdge connectors, offers low-profile and high-density designs ideal for data rates up to 56Gbps in space-constrained applications. A common footprint enables simple changeouts, while robust construction supports durability and superior SI.

The high-density HD Mezz system simplifies PCB routing and delivers high-density connectivity with speeds up to 12.5Gbps. A dual-contact mating interface and patented Solder Charge Termination provide exceptional durability, enhancing reliability and minimizing system downtime.

Modular NeoPress Connectors support both high- and low-speed signals by offering tunable differential pairs and data rates up to 28Gbps. Multiple stack-height options, customizable circuit counts and a hermaphroditic interface help enhance design flexibility.