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Mezzanine Connectors Exploded View

Connectors

Mezzanine Connectors

As demand rises for faster and more compact devices, efficient and high-speed board-to-board connectors become increasingly important. Mezzanine connectors enable multi-tiered architectures with parallel boards, delivering high-speed and high-density solutions that support more functionality for compact devices. Features such as controlled impedance, reduced crosstalk and electromagnetic interference (EMI) shielding help optimize PCB design, signal integrity and system performance.

What are Mezzanine Connectors


Mezzanine connectors are high-speed electrical connectors that connect two parallel PCBs arranged in a stacked configuration. Mezzanine connectors can offer different stack heights to vary the distance between the parallel PCBs. They are typically designed to support a specific impedance and data rate, and are optimized for high circuit density, which maximizes the use of limited real estate on the PCB. 

Key Features of Mezzanine Connectors


Mezzanine connectors utilize differential-pair interfaces for high-speed data transfer, with integrated grounding to improve signal integrity. PCB attachment options include ball-grid array, solder-charge and surface-mount termination (SMT). Certain types, like Molex Mirror Mezz Connectors, are hermaphroditic, meaning the same connector is “self-mating” and can be used on both PCBs being connected. This helps simplify design work and reduce inventory costs.

Applications of Mezzanine Connectors


Mezzanine connectors are ideal for a variety of applications where high-speed board-to-board data transfer is needed, particularly in tight spaces. In server, storage and telecommunications systems, mezzanine connectors provide high-speed connections between modules. Consumer electronics use mezzanine connectors to support multiple functions within a compact device. Automotive modules and industrial devices use mezzanine connectors to enable cutting-edge electronic systems in harsh environments with exceptional reliability.

Explore Our Mezzanine Connector Portfolio


Mirror Mezz Connectors

Hermaphroditic, footprint-compatible connectors in the Mirror Mezz family reduce application and inventory costs, maximize circuit density and improve design flexibility by offering different stack height options. Exceptional signal integrity and data speeds up to 224Gbps support telecommunications, networking and other high-performance applications. 

Data Rate Pitch Stack Height
Circuits
Up to 224Gbps 4.00 by 1.50mm differential pair pitch 5.00, 8.00, 11.00mm Up to 270 differential pairs

SEARAY / SEARAY Slim Connectors

The robust design and patented solder-charge termination technology of SEARAY and SEARAY Slim Connectors simplifies assembly and reduces the risk of damage. Multiple stack height options and a 1.27 by 1.27mm pitch grid improve design flexibility and optimize PCB real estate.

Data Rate Stack Height
Circuits
Up to 12.5Gbps 7.00 to 17.00mm 90 to 500 (SEARAY), 40 to 200 (SEARAY Slim)

NeoScale Connectors

Featuring a modular, mirror-image triad wafer design that delivers up to 56Gbps and enhances signal integrity, NeoScale Connectors offer exceptional versatility. Various stack heights, 85 or 100 Ohm impedance and designs optimized for one- or two-layer PCBs provide solutions for a variety of board-to-board connection applications.

Data Rate Circuits  Configuration Current
56Gbps 24 to 120 triad wafers 2 by 4 triad wafers (min.), 8 by 30 triad wafers (max.) 8.0A per triad

SpeedMezz Connectors

Versatile SpeedMezz Connectors offer 56Gbps data rates, multiple circuit sizes and a variety of plug options including mezzanine, edge card and cable solutions. The high-density design with SMT termination optimizes PCB space while improving signal integrity and ensuring reliable high-speed performance.   

Data Rate Stack Height Termination Style
Up to 56Gbps 4.00 to 10.00mm SMT solder tail with pin-in-paste solder nail

HD Mezz Connectors

Ideal for high-density mezzanine applications requiring data rates up to 56Gbps, durable and compact HD Mezz Connectors utilize patented solder-charge termination, guide pins and two-point mating interface contacts to enhance reliability and streamline assembly operations. 

Data Rate Stack Height Circuits
12.5Gbps 16.00 to 38.00mm 91 to 351

NeoPress Connectors

High-density NeoPress Connectors feature 76 differential pairs per square inch and a mirror-image triad wafer design that can be tuned to 85 or 100 Ohm impedance for added design flexibility. Various stack heights, data rates up to 28Gbps and durable housings ensure reliable performance and optimize the use of limited space on the PCB.

Circuits/Rows Termination Style Current
Customizable Press-fit/compliant pin 8.0A per triad, up to 28Gbps

1.00mm Mezzanine (IEEE 1386) Connectors

Ideal for applications using IEEE 1386-standard PCI mezzanine cards to connect with VMEbus and Multibus host boards, 1.00mm Mezzanine Connectors provide a shrouded housing design that minimizes the risk of contact damage, a low mating force for easy installation and multiple stack heights for enhanced flexibility.

Circuits Current Pitch
84. 164 1.0 to 2.5A 1.00mm

Datasheets and Guides