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Industrial control equipment and cabling.

IO-Link Reference Design

Optimize IO‑Link system development with reference designs that guide connector selection for reliable, scalable integration of sensors and actuators while helping reduce cabling and system complexity. Support consistent connectivity across IO-Link devices by exploring reference designs ranging from the IO‑Link master hub and digital input hub to the solenoid actuator and sensing devices. Download block diagrams, schematics and bills of materials (BOMs) to streamline integration workflows and accelerate time to market.


IO-Link digital input hubs require compact, reliable connectors to interface with multiple sensors while keeping wiring organized. High-density connectors enable engineers to manage high channel counts while maintaining orderly wiring paths that help streamline field maintenance. Molex lever-activated PCB terminal blocks provide an accessible way to connect 16 sensor inputs in a 16-channel hub, simplifying installation and serviceability.


A key challenge in IO‑Link multi‑solenoid actuators is integrating compact, reliable connections to the solenoids while minimizing wiring complexity and footprints. Secure, clearly separated connectors provide intuitive termination points for each solenoid, helping improve installation accuracy and field serviceability. Molex PCB terminal blocks provide space-saving, accessible connections for solenoid outputs in an eight-channel design, supporting faster assembly and easier maintenance.


Reliable data and power transmission between an IO-Link distance sensor and the IO-Link master are essential in demanding industrial environments. A secure field connection carries both power and IO‑Link communication through a single field interface, reducing cabling and simplifying integration. Molex M12 connectors provide compact, IP67-rated connectivity for power and IO-Link communication in harsh industrial environments.


Compact IO-Link temperature sensors must integrate sensing, communication and service interfaces in limited PCB space without adding unnecessary design complexity. Small‑footprint PCB connectors provide reliable programming and debugging access while minimizing the PCB footprint. Molex 2.00mm‑pitch Milli‑Grid PCB headers provide high-density connectivity for programming and debug ports in dense IO-Link sensors.


IO‑Link master hubs must host multiple ports for sensors and actuators without creating excessive cabling or system complexity. Standardized, individually accessible field connections simplify the design of high‑port‑count hubs, streamlining system installation, maintenance and expansion. Molex Brad Micro‑Change M12 receptacles provide reliable, space‑saving connectivity for IO‑Link master hubs, supporting streamlined integration of sensors and actuators in scalable automation architectures.