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High-Speed Internal I/O

As system architects design complex signal channels from point A to point B, they encounter obstacles that become increasingly challenging to overcome—especially at higher frequencies. Molex gives technology innovators an industry-leading portfolio of high-speed internal input/output (I/O) solutions that support next-generation speeds, thermal efficiencies and EMI containment inside the required footprint. By replacing traditional mid-boards and backplanes with performance-minded enhancements like high-speed twinax cables, pathways can be shortened to preserve signal integrity—for reconfigurable routing that adheres to current interface standards without traces on the printed circuit board (PCB).

High-Speed I/O Connectors, Connector Systems and Cable Assemblies


CX2-DS High-Speed Connectors and Cable Assemblies

The next-generation CX2-DS system is a near-package connector and cable design that supports 224G data rates for AI servers and hyperscale data centers. The modular structure, contact density and exceptional signal integrity make the system ideal for high-speed architectures.

Molex CX2-DS 224G cable assembly and socket.

KickStart Connector System

The KickStart Connector System creates an all-in-one cable-based connection system for cabled boot drives that is flexible, easy to implement, and combines power and signal circuits into a single cable.
KickStart Connector and Cable Assemblies

NearStack Connector System

NearStack High-Speed Cable Assembly Solutions deliver superior performance with Twinax wire advantages by implementing an optimized direct-to-cable connector system that maximizes system performance.
NearStack Product Family

NextStream Connector System

Next-generation NextStream Connectors and Cable Assemblies feature high-speed data transmission rates of up to 64 Gbps and meet the latest PCIe Generation 6 standard, making them ideal for a wide range of data-intensive connector-to-connector and connector-to-module applications.
NextStream Connector and Cable Assembly Mating Pair.

MicroBeam Connectors and Cable Assemblies

Delivering low-profile cabled connectivity for high-density, near-chip applications, the MicroBeam system delivers up to 112Gbps with exceptional signal integrity and 12 or 16 differential pairs. The design improves airflow and thermal management with a low overall mated height of less than 7.00mm.

MicroBeam Connectors and Cable Assemblies

Nano-Pitch I/O Connector System

Redefining solutions in the storage, mobile, and enterprise industries, Molex’s Nano-Pitch I/O (NPIO) connectors and cable assemblies offer industry-leading port density, multi-protocol support, and enhanced signal integrity to support PCIe’s OCuLink and SAS-4 (MiniLink) applications
Nano-Pitch IO Cable Assembly

Multi-Trak I/O Connectors

Multi-Trak I/O connectors offer a slim form factor with a 0.60mm pitch and are designed to transmit signal and power, providing greater flexibility in system design and meeting up to PCIe Gen 6 data transmission rates and SFF-TA-1033.
Multi-Trak PCIe Gen5 VT Connector 16X

High-Speed I/O Products by Data Rate and Protocol (Per Lane)