EdgeLine® High Speed Connectors
Low-profile EdgeLine® connectors are available in multiple orientations and PCB thicknesses for use in high-signal transmissions and high-density signal applications
Selection Matrix (images are for reference only)
25.0 Gbps Vertical
12.5 Gbps Vertical
15.0 Gbps Vertical
12.5 Gbps Signal Power ESP
15.0 Gbps CoPlanar
25.0 Gbps CoEdge
This is not a definitive list of applications for this product. It represents some of the more common uses.
Digital Product Board - EdgeLine® Mezzanine
Digital Product Board - High-Speed Coplanar
Digital Product Board - High-Speed Copper Flex and Rigid Flex Assemblies
High Speed (Signal)
EdgeLine® High Speed ConnectorsSpeedMezz Connector Family
Power
EdgeMate™ Wire-to-Edge-Card Power ConnectorEXTreme LPHPower™ Connectors
EXTreme PowerEdge™ Connectors
EdgeLine™ 25 Gbps, vertical, surface mount, without trace (s32p)
EdgeLine® 25 Gbps, vertical, surface mount, with trace (s32p)
EdgeLine® coplanar, through hole, 0.80mm pitch (s16p)
EdgeLine® vertical, 1.60mm active signal pads (s16p)
EdgeLine® vertical, press-fit (s24p)
EdgeLine®, coplanar+, press-fit (s16p)
EdgeLine®, coplanar, through hole, 0.75mm pitch (s16p)
Product Highlights
- Category:
- Edge Card Connectors
- Data Rate:
- 12.5 - 25.0 Gbps
- Pitch:
- 0.75, 0.80mm
- Board Thickness:
- .062, .093, .110, .125
Features and Benefits
- Press-fit or compliant-pin terminal design
- Easy board termination using flat-rock tooling
- Cost-effective stitched terminal
- Accommodates various signal and power requirements
- Common or singulated ground
- Optimizes connector for power and slow-speed, single-ended signals in addition to high-speed differential circuits
- Center key available on certain circuit sizes
- Improves PCB alignment during mating by relaxing board tolerances up to 0.80mm pitch
- Low-profile heights: CoPlanar Connector 6.40mm above PCB; CoEdge Connector 3.50mm above and below PCB
- Enhanced air flow and thermal management
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